04/09/2024
Thermal Conductive Potting Adhesive
Thermal Conductive Potting Gel is a one-to-one ratio, two-component electronic sealing fluid with a thermal conductivity of 1.0W/M.K. It does not corrode the electronic components, adhesive to steel, aluminum, copper, tin, rubber, plastic, wood and more. After solidification, it will not run out from the point of construction regardless the cool or hot temperature. This potting material allows the electronic components and circuits to be free from the vibrative damages.
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Features: thermal conductivity: fliud adhesive gel 0.8 ~ 3.6W/m.K, electronic insulative thermal conductive sealant.
Applications: electric vehicle (EV) batteries, 5G, autopilot system, mobile phone, AIOT, HPC (high performance computing), server, IC, CPU, MOS, LED, mother board, power supply, microinverter, LCD-TV, notebook, PC, telecom device, battery energy storage system, wireless Hub, DDR ll Module, mechatronic drive systems.