21/03/2026
Advancing Thermal Stability for High-Power IC Verification: The BGA952 Active Cooling Solution
High-power chip verification demands more than just precise electrical connection; it requires rigorous thermal control. Thermal accumulation in high-density configurations can lead to fluctuating contact resistance (Cres) and compromised signal integrity during long-term burn-in testing.
Bolan Microelectronics presents a custom-engineered BGA952 IC Test Socket designed specifically for high-power semiconductor validation.
Technical Specifications:
Type: BGA952 (952 Pin Count)
Pitch: 0.5 mm
Dimensions: 29.6 x 29.6 x 3.997 mm
Testing Lifespan: 100,000 Cycles
Thermal Solution: Integrated active cooling fan with an aluminum heatsink
Our solution ensures that even under extreme power loads, your DUT (Device Under Test) remains within optimal temperature ranges, protecting both the silicon and the testing environment.
We specialize in non-standard customization for complex pitch and specific thermal management requirements. For technical inquiries or custom project discussions, please contact our engineering team.
