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Advanced Thermal Innovation for Kilowatt-Class AI Chips

26/06/2026

MLHP Liquid Cooling Module

A pump-free two-phase cooling solution for high-power chips.

Compared with traditional pumped liquid cooling systems, MLHP is designed to reduce system complexity and leakage risk while delivering efficient heat transfer.

✅ Pump-Free
✅ Leak-Free design concept
✅ Pure water working fluid
✅ Reversible gravity operation
✅ Up to 3 kW cooling power
✅ 0.01°C/W thermal resistance

Built for AI servers, HPC, and next-generation electronics.

18/06/2026

Thermal management for high-power-density chips should be powerful, reliable, and simple.

Our MLHP Two-Phase Cold Plate is designed to deliver efficient external cooling without a pump, helping transfer chip heat outside the motherboard or chassis.

With a closed-loop negative-pressure design, the system is built to support leak-free thermal management while reducing system complexity.

Key highlights:
• Pump-free self-circulation
• Closed-loop system
• Negative-pressure design
• 3000W max heat load
• 500W/cm² max input heat flux

For AI servers, high-performance computing, and other power-dense applications, cooling innovation is becoming just as critical as chip performance.

Pump-Free Cooling. Leak-Free by Design.

15/06/2026

AI chips are getting hotter. Server cooling needs a smarter solution.

Conventional heat pipe arrays are limited when heat must be transferred over a longer distance inside the server. As the distance increases, thermal performance drops and remote fin efficiency becomes lower.

Saintinyuan MLHP remote loop cooling is designed for high-power server applications.

✅ Up to 3 kW-class cooling
✅ Ultra-low thermal resistance
✅ Long-distance heat transfer
✅ Compact two-tube design
✅ Passive and self-driven
✅ No pump required

For AI servers, HPC systems and high-density electronics, MLHP offers a practical cooling path between traditional air cooling and full liquid cooling.

12/06/2026

Can air cooling still handle 3000W chips?

Traditional heat pipe coolers struggle to transfer heat efficiently over long distances, limiting the utilization of remote fin areas.

Our Pump-Free MLHP T-Type Module leverages Loop Heat Pipe technology to transport heat farther with ultra-low thermal resistance.

✅ Up to 3000W heat load

✅ 500W/cm² heat flux

✅ Pump-free self-circulation

✅ Long-distance heat transport

✅ Ideal for AI servers, CPUs, switches and HPC systems

As chip power continues to rise, smarter heat transfer is becoming just as important as bigger heatsinks.

08/06/2026

As GPU power continues to increase, thermal management solutions must deliver higher performance without disrupting existing system architectures.

Our 1200W MLHP GPU heatsink is designed with this principle in mind.

Built around loop heat pipe technology, the solution is fully compatible with current 3DVC application requirements. Customers can adopt MLHP without changing reliability standards, operating conditions, or system-level integration approaches.

Key Features:
• Water-based working fluid
• Negative-pressure operation
• Reliability performance aligned with 3DVC requirements
• Seamless integration into existing platforms
• Efficient passive two-phase heat transfer for high-power GPUs

MLHP provides an additional thermal management option for next-generation AI servers and accelerators while maintaining compatibility with established industry practices.

04/06/2026

🔥 Why are Loop Heat Pipes gaining attention in AI server cooling?

The answer lies in the driving force behind the cooling cycle.

🔹 Traditional Heat Pipes (HP)
• Depend on capillary action inside wick structures
• Higher liquid return resistance
• Better suited for shorter heat transport distances

🔹 Loop Heat Pipes (LHP)
• Driven by pressure differential circulation
• Separate v***r and liquid flow paths
• Lower flow resistance
• Capable of efficient long-distance heat transfer

As GPU power and rack density continue to increase, reliable liquid return becomes a key factor in maintaining cooling performance.

That’s one reason why Loop Heat Pipe technology is attracting growing interest in next-generation AI servers and high-density computing systems.

What cooling technology do you think will dominate future AI infrastructure?

02/06/2026

🔥 Cooling is becoming the bottleneck of AI performance.

As GPU power keeps increasing, traditional cooling solutions face greater challenges.

MLHP (Multi-Loop Heat Pipe) technology provides:

✅ High-performance air cooling

✅ Passive two-phase heat transfer

✅ No pumps, no extra power consumption

✅ Easy integration into existing server systems

✅ Deployment experience similar to current 3DVC solutions

Designed for next-generation AI servers, HPC systems, and data centers.

Interested in learning more about MLHP technology?
Feel free to connect with us.

26/05/2026

Why is it possible to use 3000W chip level air cooling for heat dissipation?

1. Firstly, it is a consensus that 3KW air cooling cannot be achieved through traditional heat transfer technology, thus requiring a completely different technological approach.

2. Characteristics of LOOP HEAT PIPE:
· Differential pressure drive
· The pipeline is a light pipe
· The technology of gas-liquid working fluid separation

Comprehensive characteristics: Strong power and low resistance, it has the ability to transfer heat to a single kilowatt level.

3. Of course, aerospace LHP cannot meet the high power and high heat flux characteristics of GPUs. Our team has made many transformations, including design, structure, materials, etc., to form a multi loop heat pipe multi lhp that meets the requirements.

4. 3000W air-cooled, no user changes required.

We will gradually update the specific features of LHP air cooling in the future. Please stay tuned and discuss.

25/05/2026

Has air cooling reached its limit for high-power GPU OAM modules?
Not necessarily.
Traditional air cooling is still simple, flexible, and widely used in many server applications. The key question is how to make air cooling support higher heat loads and higher heat flux density.
That is why we are introducing MLHP — a high-performance Loop Heat Pipe thermal solution for GPU OAM modules.
Compared with conventional 3DVC architecture, MLHP is designed around aerospace-derived loop heat pipe technology, featuring one-way working fluid circulation, v***r-liquid separation, and direct liquid return to the die area.
It can support:
✅ Up to 2400W heat dissipation for 8U GPU OAM modules
✅ Up to 1700W for 6U applications
✅ Up to 1200W for 4U applications
✅ Heat flux density up to 450W/cm²
✅ Direct replacement without major system adaptation
3DVC remains a mature and widely recognized solution in the industry. By comparing MLHP with 3DVC, we hope to help thermal engineers and AI server designers better understand another possible path for next-generation air cooling.
Air cooling is not over.
It is evolving.

13/05/2026

Breaking the Thermal Ceiling: 3000W Air Cooling is Now a Reality! 🚀

As GPU power consumption continues to climb, 3DVC cooling has reached its bottleneck, many believe liquid cooling is the only way forward. But what if you could achieve liquid-level performance with the simplicity of air cooling?

Our latest Loop Heat Pipe (LHP) technology is a game-changer for the AI and data center industry.
✅ Direct Replacement: No complex plumbing or server redesign.
✅ Massive Capacity: Supports up to 3000W TDP.
✅ High Density: Handles heat flux up to 450W/cm².

Why compromise on complexity when you can have aerospace-grade thermal efficiency in a plug-and-play format?

Check out the attachment below for the schematic comparison! 👇

#3135 1211 7962anagement

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Website

http://www.m-lhp.com/, http://multi-lhp.com/

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