CSMH

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CSMH CSMH Semi is a Wide Bandgap Semiconductor Material and Device Manufacturer.

Meet CSMH at CIOE 2026We are pleased to participate in CIOE 2026 in Shenzhen and look forward to connecting with compani...
03/09/2026

Meet CSMH at CIOE 2026

We are pleased to participate in CIOE 2026 in Shenzhen and look forward to connecting with companies, researchers, and technology experts from across the global photonics and semiconductor industries.

From chip-level thermal management to system-level cooling, CSMH provides a comprehensive portfolio of diamond material solutions. At CIOE 2026, we will showcase Diamond Heat Sink, Diamond on Si, Diamond Copper Composite, Optical-grade Diamond Window, and Single Crystal Diamond materials, covering thermal, optical, and semiconductor applications. These solutions are already being applied across a wide range of high-power and advanced technology applications, including lasers, optical communications, AI computing chips, and power semiconductors etc, supporting the evolving requirements for higher power density, improved thermal performance, and long-term device reliability.

For more information about our diamond material solutions and application technologies, please contact us at 📧[email protected] or visit our website: 🔗 en.csmh-semi.com

📅 September 9–11, 2026
📍 Shenzhen World Exhibition & Convention Center
🏢 Hall 4 | Booth 4D205

We look forward to meeting you at CIOE 2026 and exploring new opportunities for diamond materials in next-generation photonics and semiconductor applications.

From Material to Package: Diamond on Si for 2.5D/3DAs 2.5D/3D advanced packaging pushes chip density and heat flux to ne...
20/08/2026

From Material to Package: Diamond on Si for 2.5D/3D

As 2.5D/3D advanced packaging pushes chip density and heat flux to new limits, thermal management is becoming a critical bottleneck for next-generation AI computing.

At CSMH, we believe the key is not asking semiconductor manufacturing to adapt to a new material, but engineering the material to fit existing processes.

Our Diamond on Si technology combines diamond’s exceptional thermal conductivity with silicon’s semiconductor compatibility, providing a practical pathway for faster adoption and engineering-scale mass production in advanced packaging.

By bridging the gap between extreme thermal performance and established semiconductor processes, CSMH is helping move diamond cooling from a high-performance material to a scalable thermal solution for 2.5D/3D packaging.

Interested in learning more or exploring potential applications? Connect with us—we’d be glad to discuss.

#2.5D/3DPackaging

Diamond Copper + Liquid Cooling: The Next-Generation Standard Thermal Solution for AI GPUsTraditional copper and air coo...
31/07/2026

Diamond Copper + Liquid Cooling: The Next-Generation Standard Thermal Solution for AI GPUs

Traditional copper and air cooling methods have reached their physical limits. The industry has long believed that using diamond copper for near-end cooling and liquid cooling for system-level cooling can significantly improve thermal efficiency. Actual testing shows that diamond can reduce GPU junction temperatures by 15-22°C, increasing computing power per watt by 12-18%; furthermore, for every 10°C reduction in junction temperature, chip lifespan doubles, significantly reducing replacement costs in data centers.

CSMH has launched a diamond copper composite material with a thermal conductivity of 600-1000 W/(m·K). Its coefficient of thermal expansion can be precisely adjusted to match silicon chips, offering core advantages such as high performance, cost-effectiveness, and ease of mass production. This product can be processed into various forms, including diamond copper spade teeth, liquid cooling plates, chip carriers, and package covers, to meet the needs of various application scenarios.

Please feel free to contact us with any questions or needs.
Copper cooling chip cooling

CSMH possesses excellent micro/nano fabrication capabilities. For AFM equipment, we offer high-quality probes. These pro...
28/07/2026

CSMH possesses excellent micro/nano fabrication capabilities. For AFM equipment, we offer high-quality probes. These probes offer the following advantages:
Deep-Trench Profiling: Specifically engineered for measuringhigh-aspect-ratio trenches and vertical,steep sidewalls accurately with minimalimage distortion.
Ultra-Sharp Tip GeometryAvery small half-cone angle(~5°)yields asignificantly smaller tip radius,greatly im-proving lateral scan resolution.
Extended Operational Lifetime: The conical structure with a half-coneangle

17/07/2026

Chip cooling is a critical challenge in the high-compute era. CSMH’s self-developed Diamond-on-Si thermal solution utilizes revolutionary materials and features an innovative Si-on-Si bonding design framework, which efficiently lowers junction temperatures for HPC, data center and AI hardware, resolving overheating issues on GPUs and AI chips.

, , , ,

At CSMH, we've turned efficient chip cooling from concept into reality ⚛️🔥Our innovative Diamond on Si technology achiev...
03/07/2026

At CSMH, we've turned efficient chip cooling from concept into reality ⚛️🔥

Our innovative Diamond on Si technology achieves groundbreaking heat dissipation performance through innovations in engineering materials and bonding techniques.

This solution, with its proprietary patented technology, has been verified by global GPU/CPU partners, significantly reducing chip junction temperature and possessing superior heat dissipation capabilities. Mass production has now commenced. 🚀

We have achieved industry-leading performance through three core technological breakthroughs:

- ✅ Materials Engineering: Our self-developed specialized growth equipment enables the production of ultra-large-size, uniform, and adjustable interfacial thermal resistance Diamond on Si films.

- ✅ Bonding Innovation: Redefining Diamond-Si integration, we employ low-complexity Si-Si bonding technology to construct unobstructed and highly efficient heat conduction channels.

- ✅ Packaging Optimization: Customizable Diamond-si stack structures in size/thickness match the semiconductor's coefficient of thermal expansion, alleviating thermal coupling in 2.5D/3D stack architectures.

Leveraging cross-regional patents and an intelligent end-to-end manufacturing chain🏭, this engineered thermal solution can be extended to high-temperature applications such as AI PC, AI chips, and data centers.

Want to learn more? Contact us.
PC # on Si

Diamond is the ultimate thermal management material, with thermal conductivity reaching up to 2200 W/(m·K). But measurin...
01/07/2026

Diamond is the ultimate thermal management material, with thermal conductivity reaching up to 2200 W/(m·K). But measuring that extreme performance accurately? That‘s where things get challenging.
Unlike conventional methods, our TDTR uses a non-contact optical pump-probe technique that measures thermal properties through surface reflectivity changes. It delivers precise, reliable data for ultra-high thermal conductivity materials — including diamond, SiC, and nanoscale films — across a measurement range of 1–2200 W/(m·K).Curious about how TDTR can help with your diamond or advanced material testing? Let‘s connect — I’d love to chat.

Diamond Application Solutions of EUV Lithography CO2 Optical window
13/01/2025

Diamond Application Solutions of EUV Lithography CO2 Optical window







Diamond is characterized by extremely highhardness, high thermal conductivity andchemicalinertness.In addition, diamond ...
13/01/2025

Diamond is characterized by extremely highhardness, high thermal conductivity andchemicalinertness.In addition, diamond iscomposed of carbon,alowZ(Z:atomicnumber)material, and is transparent toX-rays, which is essential for X-ray windows.
A CvD diamond window coated with a tungsten film is welded to a metal frame thatserves as an X-ray transmission target or high-power X-ray anode,and the tungstenlayer is irradiated (bombarded) with a high-en-ergy electron beam to create a single-pointX-ray source.

In this application, diamond plays two major roles: one, diamond takes advantage of its ul.tra-high thermal conductivity to rapidly conduct heat out of the focusing area; two, diamond has a high transmittance and can beused as a window for the transmission of X-rays. Therefore, by placing the object under study very close to the X-ray point sourcehigh-resolution and high-magnification X-rayinspection can pe realized.








Wishing you a joyful Christmas and aNew Year filled with blessings and good fortune.🎉🎉🎉
25/12/2024

Wishing you a joyful Christmas and aNew Year filled with blessings and good fortune.🎉🎉🎉

Address

No. 253 Guankou Avenue, Jimei District, Xiamen City
Xiamen
360000

Telephone

+8613616001136

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