20/08/2026
🤖As advanced packaging pushes into chiplets, silicon photonics, and HPC, one thing becomes clear: the future depends on how precisely you can test and inspect it. 🔬That's what we're bringing to SEMICON Taiwan 2026. 🚀
🔎 What you'll discover at our booth:
🔷 Silicon Photonic Double-Sided Wafer Prober — Tests both the optical and electrical performance of silicon photonics devices in one platform.
🔷HPC Burn-In System — Dynamic burn-in system for next-generation AI and high-performance computing devices.
🔷Advanced Wafer AOI System — An innovative AI-powered wafer AOI system that redefines advanced wafer inspection down to sub-micron detectability.
🔷Die-Level & Chiplet Prober — Precision die-level probing and testing for next-generation AI and HPC devices.
🔷3D X-Ray Inspection System — Computed Laminography for precise 3D imaging and internal defect analysis.
We're excited to invite you to visit us at SEMICON Taiwan 2026 and see our advanced test & inspection systems come to life. ✨
📍 Booth i2830, TaiNEX 1
📅 2–4 September 2026 · Taipei