Synopsys Armenia

24/08/2026

Earlier this month, Synopsys Armenia was honored to host H.E. Joseph Nzabamwita, Ambassador of the Republic of Rwanda, and members of his delegation at our Yerevan office. Building on the visit of Rwanda's Minister of ICT and Innovation, Yves Iradukunda, last year, the meeting provided another valuable opportunity to showcase Armenia's strengths in microelectronics, innovation, and engineering education.

During the visit, we shared Armenia's longstanding achievements in microelectronics and highlighted Synopsys Armenia's contributions to the development of the country's high-tech ecosystem, engineering talent, and educational programs.

We were pleased to discuss the role of the International Microelectronics Olympiad in inspiring and empowering the next generation of innovators and look forward to welcoming a finalist from Rwanda to Yerevan this November for the 21st Olympiad.

We thank Ambassador Nzabamwita for his visit and valuable interest in Armenia's technology and innovation journey.

17/08/2026

📢 Ուշադրություն բոլոր ուսանողներին և բարձր դասարանցիներին։

Ցանկանո՞ւմ եք խորացնել ձեր գիտելիքները և պատրաստվել Սինոփսիս ընկերության կրթական ծրագրին։ Այս հնարավորությունը հենց ձեզ համար է։

🎓 Սինոփսիս Արմենիայի Ուսումնական Դեպարտամենտը սիրով հրավիրում է բոլոր հետաքրքրված ուսանողներին և բարձր դասարանցիներին մասնակցելու անվճար լրացուցիչ դասընթացների՝
🔹 «ԹՍ թվային և տրամաբանական հիմունքներ»
🔹 «Էլեկտրատեխնիկա»

Այս դասընթացները հատկապես կարևոր են 2-րդ կուրսի ուսանողների համար, ովքեր ցանկանում են 3-րդ կուրսից շարունակել ուսումը Սինոփսիսի «Բուհ-արտադրություն» կրթական մոդելով իրականացվող ծրագրում, որը գործում է Հայաստանի հինգ առաջատար բուհերի հետ.
✅ Հայաստանի ազգային պոլիտեխնիկական համալսարան (ՀԱՊՀ)
✅ Երևանի պետական համալսարան (ԵՊՀ)
✅ Հայաստանի ռուս-հայկական (սլավոնական) համալսարան (ՀՌՀ)
✅ Հայաստանի եվրոպական համալսարան (ՀԵՀ)
✅ Հայաստանում ֆրանսիական համալսարան (ՀՖՀ)

Ինչո՞ւ մասնակցել.
✅ Անվճար մասնակցություն
✅ Առցանց ձևաչափ
✅ Միացում ցանկացած վայրից
👨‍🏫 Դասընթացները վարում է Սինոփսիս Արմենիայի Ուսումնական Դեպարտամենտի տնօրեն, ՀՀ ԳԱԱ թղթակից անդամ, պրոֆեսոր Վազգեն Մելիքյանը, ով ղեկավարում է դեպարտամենտը հիմնադրման օրվանից։

📅 Օգոստոսի 17-ից մինչև դեկտեմբերի 18-ը
🕟 Ամեն շաբաթ՝ երկուշաբթիից հինգշաբթի
⏰ 16:30 - 18:00

🔗 Միացման հղում
https://synopsys.zoom.us/j/7377023003?pwd=ck1IWVRvZmFTQ01mVERSQm1FbkJFZz09

⚠️ Կարևոր. Այս դասընթացը չի կրկնվելու, ուստի բաց մի թողեք բացառիկ հնարավորությունը ձեռք բերելու ամուր հիմքեր, զարգացնելու ձեր մասնագիտական գիտելիքները և պատրաստվելու Սինոփսիսի կրթական ծրագրին մասնակցելուն։

🚀 Ձեր ապագան սկսվում է այսօր։ Միացե՛ք և կատարե՛ք հաջորդ կարևոր քայլը դեպի միկրոէլեկտրոնիկայի և բարձր տեխնոլոգիաների աշխարհ։ 💜

12/08/2026

Behind the world’s fastest supercomputers is an enormous amount of unseen engineering mastery. Chips must be designed, verified, and delivered on tight schedules. Expertise and resources are often limited. And complexity continues to rise.

For Hewlett Packard Enterprise (HPE), that challenge is especially acute within the Slingshot organization, which develops the high‑speed interconnect fabric that powers leading high‑performance computing (HPC) systems.

David Lacey, a distinguished technologist at HPE, sits at the intersection of engineering, methodology, and technology strategy. Trained as a verification engineer, he now works across teams to improve productivity, evaluate new technologies, and ensure that Slingshot silicon meets both quality and schedule goals.

“My role gives me the opportunity to work across pretty much all of our teams,” Lacey says. “That includes guiding how we improve our methodologies, integrate new technologies, and ultimately deliver new generations of Slingshot chips.”

Learn how HPE boosts HPC chip development with Synopsys tools, elastic compute resources, streamlined verification, and AI-driven workflows.

07/08/2026

Space missions have always depended on simulation. What has changed is the fidelity, scope, and practical value of those simulations.

As NASA and the broader space community prepare for future Artemis missions, those advances are becoming essential. Returning humans to the Moon and establishing a sustained presence there will require more than launch, flight, and landing capabilities. It will also require communications systems that perform reliably in an extreme and largely unfamiliar environment.

Every asset, assumption, and variable must be tested and validated well before launch. That includes the high-bandwidth cellular network planned for the lunar surface and the antenna-bearing systems that will depend on it, including spacesuits, rovers, landers, and orbital relays.

At Synopsys, we are helping create a digital twin of the Moon to test and validate those systems.

Working with Cesium, part of Bentley Systems, Keysight, and NASA’s Glenn Research Center through the Lunar 3rd Generation Partnership Project (Lunar 3GPP), we are combining high-fidelity topography, communications modeling, mission dynamics, and hardware validation in a virtual environment designed to support Artemis planning and operations.

Discover how a lunar RF digital twin helps model wireless coverage, validate antennas, and reduce communications risks for Artemis missions.

05/08/2026

The computing demands of AI are pushing chip design beyond what a single piece of silicon can efficiently deliver.

“You have this beast that needs to be fed,” said Raja Swaminathan, corporate vice president at AMD, speaking alongside other executives from Broadcom, TSMC, and Synopsys at the 2026 Synopsys Executive Forum, part of Synopsys Converge. “The AI compute curve demands more than 4× per year scaling. You need a lot of innovation beyond what Moore’s Law is giving us.”

That innovation is increasingly happening at the system level, with multi-die designs that integrate chiplets on ever-larger substrates. Industry roadmaps already point toward system-on-wafer and, eventually, system-on-panel architectures.

The consequences are multifold. Multi-die systems are pushing multiphysics upstream, blurring domain boundaries, and accelerating the adoption of AI tools and digital twins.

Learn how multi-die architectures are driving multiphysics analysis, co-design workflows, AI-driven exploration, and next-generation chip innovation.

28/07/2026

Join Synopsys at Design Automation Conference (DAC) 2026 to explore agentic AI, Multiphysics Fusion, and advanced 3DIC, digital, verification, and photonics workflows.

Stop by our booth ( #631) and technical sessions for live demos and practical guidance to accelerate convergence, improve predictability, and reduce late-stage surprises. Learn more: https://bit.ly/4ydvFlN

24/07/2026

Looking back at our Children's Day celebrations, we're delighted to share moments from two memorable events that brought together Synopsys Armenia children.

Our younger guests enjoyed Kiddos @ Synopsys, a day filled with interactive shows, creative activities, surprises, and laughter. For older children and teens, Kidovation @ Synopsys offered a chance to step into the spotlight, presenting their science and technology projects and sharing their ideas with the community.

From playful moments to innovative thinking, these events showcased the energy, talent, and curiosity of the next generation. Thank you to all the children who participated and to everyone who helped make these experiences possible. 💜👏

23/07/2026

When I was an undergrad studying electrical engineering, there was a clear divide between those who liked analog and those who preferred digital.

Digital was appealing because it was predictable. Signals were either high or low, ones or zeros. You could design systems so uncertainty stayed neatly inside controlled boundaries, and then you could make clean, binary decisions.

Analog was messier. You had to think about fields, waves, waveforms, and behavior that didn’t always do what you wanted.

For a long time, digital engineers tried to design those analog problems out of the system. Differential signaling, repeaters, tighter noise margins. Those tricks worked, right up until they didn’t.

Eventually, the physics caught up to us.

That happened in a very visible way in the early 1990s, when clock speeds and edge rates got fast enough that wires stopped behaving like wires. They became transmission lines. Signals started reflecting, attenuating, and distorting. Suddenly, electromagnetics — which many digital designers had happily avoided — was no longer optional. Signal integrity emerged as a discipline out of necessity.

The lesson was clear: digital abstractions hold only as long as physics cooperates.

Today, the industry is facing a much larger version of that same reckoning. It’s no longer just the wires that run up against physics. It’s the entire chip. And the package. And the board. And the system in which they operate.

As chip density and advanced packaging increase, physics has become a first-order chip design constraint, shaping performance, yield, and reliability.

22/07/2026

♻️ At Synopsys, we believe sustainability is more than an initiative, it's a shared commitment.

In 2026, Synopsys Armenia continues to advance responsible waste management practices across its offices through its waste-sorting efforts.

Since its launch in 2019, this long-term environmental program, implemented in partnership with ISSD - Innovative Solutions for Sustainable Development of Communities NGO, has become a natural part of everyday workplace life, helping foster environmental awareness, employee engagement, and more sustainable habits.

The strong participation of employees during the reporting period reflects an ongoing commitment to reducing waste and supporting recycling efforts. Over time, these collective actions have contributed to positive environmental outcomes while encouraging greater awareness and stewardship across our sites in Yerevan and Gyumri.

A heartfelt thank you to our employees for embracing sustainable practices and helping make a positive difference every day. 💚💜

📊 Here are the key program results and impact highlights for the first half of 2026:

🌱 Small actions. Shared responsibility. Sustainable impact.

21/07/2026

We are proud to see Synopsys CTO & Fellow, Synopsys Armenia President Dr. Yervant Zorian sharing his insights and vision with the global semiconductor community at International Test Conference (ITC) India 2026.

In his keynote, “Designing Chiplets and 3DIC for Quality and Reliability,” Dr. Zorian highlighted the opportunities and challenges of next-generation semiconductor architectures, emphasizing the critical importance of quality, reliability, and testability in chiplet-based and 3D integrated systems.

As heterogeneous integration and advanced packaging continue to drive innovation, thought leadership and collaboration remain essential to shaping the future of intelligent silicon systems.

Congratulations to Dr. Zorian on this inspiring contribution to the global semiconductor community.