13/02/2026
Register today!
Oxford Instruments ๐๐ฒ๐ฏ๐ถ๐ป๐ฎ๐ฟ - From Innovation to Integration: Overcoming Interface Challenges in WBG Power Devices
Highlights:
โข The role of WBG semiconductors like SiC and GaN in advancing power electronics
โข Challenges and solutions in interface engineering and reliability
โข High-volume plasma-based fabrication techniques
โข Surface engineering for enhanced device performance
โข Cutting-edge characterization methods such as EBSD and AFM
Learn more and register below: https://oxfordinstruments.brandlive.com/Overcoming-Interface-Challenges-in-WBG-Power-Devices/en