19/05/2026
# # # Advanced COG & FOG Bonding Machine Series: Precision Solutions for Display Manufacturing
In the rapidly evolving landscape of display manufacturing, precision and efficiency are paramount. Our advanced series of **COG (Chip on Glass) and FOG (FPC on Glass) bonding machines** are engineered to meet the rigorous demands of modern LCM (Liquid Crystal Module) production. Whether you are manufacturing smartwatches, mobile phones, or large-format displays, our modular equipment ensures exceptional bonding accuracy and high throughput.
Below is a detailed breakdown of our machine series, designed to cater to various screen sizes and production complexities.
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# # # # ⚡ 600 Series: High-Speed Solutions for Small Displays
**Target Size:** 1 - 7 Inch
**Key Feature:** Ultra-fast Tact Time (TT) down to **3.5s**
The **600 Series** is optimized for compact displays, making it the ideal choice for wearables and handheld devices. It supports flexible and irregular-shaped products, ensuring versatility in modern design.
- **OL-LEC600D:** Combines Glass Loading with EC Cleaning. Perfect for single-side, single-chip bonding with high-speed capabilities.
- **OL-CB600D:** Dedicated unit for precise COG bonding.
- **OL-FBL600D:** Integrates FPC loading directly with the FOG bonding process for streamlined operation.
# # # # 📱 800 Series: Versatility for Mid-Size Screens
**Target Size:** 1 - 10.1 Inch
**Key Feature:** Balanced performance with a TT up to **4.5s**
Designed for a broader range of applications including tablets and industrial displays, the **800 Series** handles single-side, single-chip configurations with ease.
- **OL-LLD1000:** Efficient Glass Loading module.
- **OL-ECB800:** Specialized COG Bonding station.
- **OL-FB800:** Dedicated FOG Bonding unit.
- **OL-FLD1000:** Standalone FPC Loading module.
# # # # 💻 900 Series: Advanced Bonding for Large Panels
**Target Size:** 5 - 15.6 Inch
**Key Feature:** Supports **1-2 chips** (same type) and U-shaped FPCs
The **900 Series** steps up to handle larger panels like laptops and monitors. It features an extended **160mm FOG head length** and reserved functionality for flexible bonding processes.
- **OL-LLD1000:** Robust Glass Loading system.
- **OL-ECB900:** High-precision COG Bonding.
- **OL-FB900:** FOG Bonding optimized for larger surfaces.
- **OL-FLD1000:** FPC Loading station.
# # # # 🚀 1500 & 2000 Series: The Flexible & COF Specialists
**Target Size:** 1 - 7 Inch
**Key Feature:** Supports **COF processes**, Flexible/Irregular shapes, and TFOG
These series represent the cutting edge for small-to-mid-sized flexible displays. The **1500 Series** offers a TT down to 4.5s, while the **2000 Series** pushes speed further with a TT down to **3.5s**. Both support complex COF (Chip on Film) and TFOG bonding.
- **Glass Loading:** OL-LLD1000 (1500 Series) / OL-LLD2000 (2000 Series).
- **Cleaning & Prep:** OL-ECB1500 (EC Cleaning + COG) / OL-EC600 (EC Cleaning). Includes **OL-TEC1000** for TP Cleaning.
- **COF Processing:** **OL-CC2000** for precise COF Cutting.
- **Bonding Units:** OL-CB2000 (COG), OL-FB2000 (FOG & TFOG).
- **FPC Handling:** OL-FBL1000 and OL-FLD2000 for integrated loading and bonding.
# # # # 🏭 3000 Series: Heavy-Duty Multi-Chip Bonding
**Target Size:** 5 - 17.3 Inch
**Key Feature:** **Multi-side, Multi-chip** capability (1-2 types of ICs/FPCs)
For large-format and complex display assemblies, the **3000 Series** delivers industrial-grade performance. It handles multiple ICs and FPCs simultaneously, featuring a 160mm FOG head and U-shaped FPC support.
- **OL-LLD1000/LLD2000:** High-capacity Glass Loading.
- **OL-EC3000:** Edge Cleaning (EC) system.
- **OL-CB3000 & OL-FB3000:** High-volume COG and FOG Bonding.
- **OL-PB3000:** Specialized FOB (FPC on Board) Bonding.
- **OL-FLD1000/FLD3000:** Versatile FPC Loading options.
# # # # 🔮 6000 Series (In Planning): The Future of Automation
**Target Size:** 5 - 17.3 Inch
**Key Feature:** **Dual-Arm Handling** for maximum efficiency
Building upon the robust capabilities of the 3000 Series, the upcoming **6000 Series** introduces **dual-arm handling technology**. This upgrade is designed to significantly enhance throughput and handling stability for multi-side, multi-chip bonding on large panels.
- **Upgraded Handling:** OL-LLD1000/LLD2000 with dual-arm architecture.
- **High-Performance Modules:** Includes OL-EC6000 (Cleaning), OL-CB6000 (COG), and OL-FB6000 (FOG).
- **Advanced Assembly:** Retains OL-PB3000 for FOB bonding and OL-FLD series for loading.
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**Why Choose Our Bonding Solutions?**
Our equipment lineup is designed to optimize the entire value stream of display manufacturing. From **plasma cleaning** and **ACF attachment** to precise **thermal compression bonding**, every model ensures high yield rates and superior electrical connectivity.
- **Compatibility:** Supports LCD, OGS, One Film Sensor, and flexible substrates.
- **Precision:** Advanced visual alignment systems (CCD) ensure mic
