22/10/2026
Streamline your workflows and boost throughput for ✨
The new platform microPREP L enables fast, precise, reproducible, and non-destructive material removal at scale to unlock major productivity gains in semiconductor failure analysis, process development, and quality assurance.
The tool is designed to support sample sizes up to whole 12-inch (300-mm) wafers and system-level boards.
For more details, please visit www.microprep.pro