01/06/2026
How many steps does it take to create a wafer full of chips?
Our plasma and laser technologies support roughly 80% of the steps in chip production. You may not see our name on the finished product. But our work is inside. In the coating that builds the layers. In the etching that sculpts trenches and vias. In the light that writes the structure with nanometer precision.
Today, a single chip can involve more than 2,000 process steps - each one critical to performance, power efficiency, and yield. Chipmaking is split into two worlds: frontend and backend. The frontend is the cleanroom phase where electronic circuits and transistors are built layer by layer directly onto silicon wafers - a highly complex, weeks‑long sequence of chemical and physical operations like those shown in the graphic.
TRUMPF is already there, at the tool and at the fab, alongside partners and customers across Asia, the US, and Europe. And we have been for decades.
