X-FAB

Name: X-FAB
Address: HaarbergStr. 67, Erfurt, 99097, DE
Telephone: +493614276162
Price range: Not applicable

X-FAB is the leading foundry group manufacturing silicon wafers in More-than-Moore technologies. (HRB) 111661

USt-Id Nr.: DE 150 116 921

As the world's leading foundry group for analog/mixed-signal semiconductor applications, X-FAB creates a clear alternative to typical foundry services by combining solid, specialized expertise in advanced analog and mixed-signal process technologies with excellent service, a high level of responsiveness and first-class technical support. X-FAB manufactures wafers for automotive, industrial, consum

er, medical, and other applications. With its six manufacturing sites in Germany, France, Malaysia and the USA, X-FAB employs approx. 4,200 employees worldwide. Imprint:
X-FAB Semiconductor Foundries GmbH
Haarbergstr. 67
99097 Erfurt
Germany

p +49-361-427 60 00
f +49-361-427 61 11
e [email protected]
w www.xfab.com

Managing Director: Dr. Gabriel Kittler
Registered at Amtsgericht Jena; No.

21/08/2026

✏️ Back-2-School Bash = SUCCESS! 📚

A huge to the X-FAB Texas Employee Engagement Committee and everyone who donated, helped organize, and supported our X-FAB families as they geared up for another school year! ❤️

From backpacks and notebooks to pencils, crayons, and plenty of school-day essentials, it was awesome seeing our X-FAB community come together to make back-to-school season a little easier.🍎✨

Wishing all of our X-FAB students an school year! 🎓📓🚌

21/08/2026

We are proud to support IIT 2026 as a Bronze Partner! ✨

X-FAB is pleased to announce its sponsorship of the 25th International Conference on Ion Implantation and Annealing Technology (IIT 2026), taking place in Villach, Austria, from 20-24 September 2026. The conference brings together experts from industry, research institutes, and academia to discuss the latest advances in ion implantation, annealing, process integration, metrology, and emerging semiconductor applications.

As a specialty foundry, X-FAB recognizes the critical role that ion implantation and annealing technologies play in enabling next-generation semiconductor devices. We are excited to support this important forum for knowledge exchange, innovation, and collaboration.🫰🏼

We look forward to connecting with fellow researchers, technology developers, equipment suppliers, and semiconductor professionals in Villach.

📅 20-24 September 2026
📍 Villach, Austria
🔗 Learn more about the event: IIT 2026 Conference Website

19/08/2026

🏆 From German Record to the U20 World Championships 🚀

An exceptionally successful season has come to an end for Marc Leonard Hildebrand at the U20 World Athletics Championships in Eugene, USA. By winning the German U20 Championship🏆, setting a German U20 record in the 110 m hurdles⚡, and qualifying for the World Championships🌍, Marc demonstrated his outstanding potential on both the national and international stage.

In Eugene, Marc continued his strong form and advanced to the semi-finals of the U20 World Championships, placing him among the world's top young hurdlers in his age group.💪🏼Although a fall in the semi-final prevented him from reaching the final, it does not diminish the remarkable achievements of his season.🚀

At X-FAB, we are proud to support and encourage young talents as they pursue their goals and develop their potential.🫰🏼We congratulate Marc, his coaches, and the entire Dresdner Sportclub 1898 E.V. team on an outstanding season and wish him continued success in the challenges ahead. 👏🏼 - That's !

14/08/2026

From Wafer to Vision: Advancing Microdisplay and Photonics Solutions

How can specialty semiconductor technologies help bring the next generation of optical systems to life?

🗣️We're excited that Joerg Doblaski will speak at the upcoming Fraunhofer IPMS Industry Partner Day on 20 August 2026, where he will explore how X-FAB’s Smart CMOS & SOI, photonics, MEMS, and heterogeneous integration technologies are enabling innovations in imaging, sensing, microdisplay, and photonic applications.

The presentation will also spotlight the long-standing collaboration between X-FAB and Fraunhofer IPMS and show how joint development activities, R&D projects, and technology innovations continue to push the boundaries of optical technologies, from wafer to vision. 🚀

📅 20 August 2026
📍 Fraunhofer IPMS, Dresden
🔗 Learn more about the event:https://www.ipms.fraunhofer.de/en/events/2026/2026-Industry-Partner-Day.html

We look forward to insightful discussions and networking with partners from across the semiconductor and photonics ecosystem.🫰🏼

05/08/2026

🚀Mature process nodes are anything but out of fashion

When selecting a foundry, most discussions revolve around process technology. ⚙️

And rightly so.

✨But every successful product is also shaped by the manufacturing environment behind it. By the people, the processes and the experience that ensure every wafer meets the same high standards, year after year.

At X-FAB, our proven 350nm CMOS platform is manufactured at our sites in Dresden, Germany, and Kuching, Malaysia. Together, they combine decades of specialty foundry experience with proven manufacturing excellence and a resilient global production network. 🚀

👀Take a look inside our manufacturing sites and discover the environments behind X-FAB's proven 350nm CMOS platform.

👉🏼X-FAB Dresden: www.xfab.com/manufacturing/dresden

👉🏼X-FAB Kuching: www.xfab.com/manufacturing/kuching

Choosing a foundry isn't just about selecting a technology. It's about choosing a manufacturing partner you can trust. 🫰🏼

03/08/2026

☀️ Another great Employee Picnic is in the books! Despite a little Texas rain, we still came together for a weekend full of great food, games, laughter, and quality time with our X-FAB Texas family. Rain or shine, it was a weekend to remember. 💙

🫰🏼A huge thank you to everyone who attended and to all of the volunteers and Employee Engagement Committee members who worked behind the scenes to make the event possible. 🫶🏼

A special shoutout to our CEO, Rico Tillner, and our COO, Mac Johnson, for firing up the grill and serving burgers🍔 and hot dogs🌭, and to everyone else who stood over the grill in the Texas heat, and rain to keep everyone fed. Your dedication didn’t go unnoticed!

And of course, no picnic is complete without something sweet! 🤭 A big thank you to Dipped by L&K for generously donating the delicious cake pops that were a hit with everyone. We truly appreciate your support. 🧁🥰

31/07/2026

🌍💧 Behind every chip is a drop of innovation: Exploring the infrastructure behind every reliable wafer.

From 22–26 June 2026, X-FAB Sarawak celebrated EHS Week 2026, bringing employees together through a series of activities designed to strengthen awareness of Environmental, Health and Safety (EHS) practices.

One of the highlights of the week was the Ultra Pure Water (UPW) Process Tour, which offered employees a behind-the-scenes look at a critical system supporting semiconductor manufacturing.

💧 The UPW system plays an essential role in producing exceptionally pure water to support highly precise manufacturing processes, helping maintain the cleanliness, consistency, and control required.

The tour demonstrated that EHS is more than a workplace commitment. It is an integral part of the infrastructure, discipline, and operational excellence that enable X-FAB Sarawak to deliver high-quality and reliable semiconductor solutions at scale.

Sustainable growth starts with a strong foundation. 🌱🏗️

As X-FAB Sarawak continues to serve customers with its fully expanded production capacity, critical infrastructure such as the UPW system helps ensure that production scale is matched by the quality, reliability, and consistency our customers expect.

30/07/2026

X-FAB published financial results for the second quarter 2026.
Find the press release here: www.xfab.com/investors/news

24/07/2026

Redefining Europe Semiconductor Production Landscape

📢 Featured Interview: Dr. Gabriel Kittler, CEO of X-FAB Erfurt

From semiconductor sovereignty and advanced microsystems to photonics and wide-bandgap technologies, Dr. Kittler shares how X-FAB is expanding capabilities and helping shape the future of semiconductor manufacturing in Europe. The interview explores key developments including the latest expansion plans in Microsystems ( ), heterogeneous integration, strategic research collaborations, and the growing role of silicon carbide and gallium nitride technologies.

Thank you to EPDT for the opportunity to discuss these exciting developments.

➡️ Read the full interview here:

https://www.epdtonthenet.net/article/222844/Redefining-Europe-Semiconductor-Production-Landscape-An-Interview-with-X-FAB-s-Dr--Gabriel-Kittler.aspx

22/07/2026

🚀 Unlock Next-Gen Medical Ultrasound Transmit Receive ICs with 110nm BCD-on-SOI 🚀

Developing high performance ultrasound front-ends poses a long standing design challenge: packing high-voltage transmit circuits alongside ultra-sensitive, low-noise receive paths within a single IC.

110nm BCD-on-SOI rises to the challenges to deliver higher integration, smaller footprints, and smarter ultrasound system design. 💡

✅ Compact form factor for next-gen probes:
- 2× standard cell density vs. 180nm enables significantly more on-chip digital content
- Smaller geometry + reduced isolation spacing → smaller die size
- Enables compact, high channel-count ICs for portable and ICE ultrasound systems

✅ True SOI isolation (DTI):
- Eliminates latch‑up and substrate coupling
- Ensures robust Tx/Rx integration with minimal cross-talk

✅ Highly integrated mixed-signal platform
- Combine HV drivers, low-noise analog front-end, and dense digital logic on one chip
- Simplifies system architecture and reduces BOM

✅ Optimized HV & signal performance:
- Efficient HV pulsers with improved device performance
- Excellent signal integrity for high dynamic-range receiving paths

🔍 With 110nm BCD-on-SOI, IC designers can move toward fully integrated Tx/Rx + digital beamforming SoCs in a dramatically reduced footprint to accelerate innovation in compact, high-performance medical ultrasound systems.

Learn more about X-FAB’s 110nm BCD-on-SOI solutions here: https://www.xfab.com/xt011

Adresse

HaarbergStr. 67
Erfurt
99097

Telefon

+493614276162

Webseite

http://xfab.com/

Benachrichtigungen

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