ERS electronic GmbH

Name: ERS electronic GmbH
Address: Stettiner Str. 3+5, Germering, 82110, DE
Telephone: +49898941320
Price range: Not applicable

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Deutschland
Germering
ERS electronic GmbH

ERS is a customer-centred firm that has been walking side by side with its customers to achieve their business goals since 1970.

ERS has been supplying innovative thermal test solutions to the semiconductor industry since 1970 and is famous for fast-ramping and precise low-noise thermal systems (-65°C to +500°C) for analytical, parametric and wafer sort probing up to 300mm. The patented ERS flagship product for hot/cold wafer test, AC3(R), is available for package-level tri-temp applications for MEMS test. ERS designs and b

uilds stand-alone thermal-forcing systems and custom production tools for difficult thermal applications. ERS supplies the advanced wafer level packaging market with its fully automatic debonders and warpage adjust tools used in the production of both 200mm and 300mm eWLB device packages. On a broader scale, ERS supports not only eWLB but many other Fan-Out Wafer-Level-Package (FOWLP) technologies with its factory competence center that opened in March 2011. ERS has its headquarters, sales department, engineering center and production facilities in the Munich suburb of Germering, and has support offices in the US, Singapore and Taiwan. ERS liefert seit 1970 innovative thermische Testlösungen für die Halbleiterindustrie und ist bekannt für schnelle und präzise geräuscharme thermische Systeme (-65 ° C bis + 500 ° C) für analytische, parametrische und Wafer-Sortierung bis 300 mm . Das patentierte ERS Flaggschiffprodukt für den Heiß / Kalt-Wafertest, AC3 (R), ist für Tri-Temp-Anwendungen auf Gehäuseebene für MEMS-Tests verfügbar. ERS konstruiert und fertigt stand-alone Thermo-Forcing-Systeme und kundenspezifische Produktionswerkzeuge für schwierige thermische Anwendungen. ERS beliefert den Markt für hochentwickelte Waferlevel-Packages mit vollautomatischen Debondern und custom production tools, die bei der Herstellung von eWLB-Gehäusepaketen für 200 mm und 300 mm verwendet werden. Auf breiterer Ebene unterstützt ERS nicht nur die eWLB, sondern auch viele andere Fan-Out-Wafer-Level-Package-Technologien (FOWLP) mit seinem im März 2011 eröffneten Factory-Kompetenzzentrum. ERS hat seinen Hauptsitz, seinen Vertrieb, sein Technikzentrum und seine Produktionsstätten in dem Münchner Vorort Germering, und hat einen Vertrieb in den USA, Singapur und Taiwan.

04/09/2026

Last day at SEMICON Taiwan 2026! A big thank you to everyone who visited our booth, shared ideas, and made these three days in Taipei so memorable.

Although SEMICON Taiwan is coming to an end, our global exhibiting journey continues!

Next week, September 9–11, we’ll be exhibiting at ESTC 2026 in Helsinki. We look forward to continuing the conversation around wafer- & panel-level debonding, and warpage correction.

📍 ESTC 2026 | Helsinki | Booth #5

See you there!

03/09/2026

A big thank you to 新電子科技雜誌 Micro-Electronics for featuring us in the latest magazine! Ahead of our presentation in Hsinchu, our Senior System Architect was interviewed by the team, where we discussed the latest developments and challenges in panel-level bonding and debonding solutions for advanced packaging.

We’re pleased to share a short summary of the article below:

As AI continues to drive demand for larger packages, moving from circular wafers to square panels offers greater throughput, but increasing size and changing geometries also introduce new challenges :

🔹CTE mismatches across larger surface areas create increasingly complex thermal stresses.
🔹Square panels introduce corner lift, twist, and alignment challenges that are not present with symmetrical wafers.
🔹Glass carriers provide greater rigidity, but also increase the risk of cracking during processing.
🔹Different panel sizes require equipment suppliers to develop modular and customized handling solutions.

Ultimately, the success of panel-level packaging comes down to yield and cost. Controlling thermal stress and warpage before they impact yield will be key to unlocking true high-volume production.

Want to learn more? Contact our team at [email protected].

02/09/2026

Our Semicon Taiwan 2026 kicked off with an in-depth interview with journalist Judit, from Silicon-press, discussing the latest challenges and solutions in panel-level debonding and warpage correction.

Meanwhile, our booth has been buzzing with activities. We were excited to welcome visitors throughout the day, with plenty of technical discussions, questions, and lively exchanges around advanced packaging and thermal wafer probing. It was great to see so much interest in how our technologies can address their challenges.

The show continues tomorrow, come find us at TaiNEX Hall 1, 4F, Booth M0257. We’d love to talk with you!

27/08/2026

A big thank you to 新電子科技雜誌 for inviting us to the forum🤝 Our Senior System Architect delivered an insightful presentation on the topic of panel-level TBDB and warpage correction, highlighting how ERS brings 55 years of thermal management expertise from wafer probing into advanced packaging.

Temperature control has always been at the heart of what we do. Today, we leverage this deep knowledge and experience to address critical challenges in warpage correction, temporary bonding, and debonding for both wafers and panels.

Want to discuss your advanced packaging challenges? Drop us a comment below; we’d love to connect!

26/08/2026

SEMICON Taiwan is next week! We’re all set and excited to be part of one of the world’s biggest semiconductor events. Our team is ready to connect, exchange ideas, and showcase our latest solutions. Come meet us in Hall 1, 4F, booth M0257, from Sept 2 to 4. We look forward to seeing you there!

25/08/2026

We’re attending the Electronics System-Integration Technology Conference (IEEE-ESTC) in Finland from September 9–11! We'll showcase our latest solutions for temporary bonding & debonding, plus warpage correction, available at both the wafer and panel levels. Stop by Booth #5 to explore our technologies and discuss your challenges with us. We look forward to seeing you soon in Helsinki!

19/08/2026

Panel-level packaging (PLP) first emerged as a cost-efficient alternative to wafer-level packaging. But with the rapid growth of AI accelerators and HPC, PLP is taking on a much bigger role: addressing package sizes that can be 3–10× larger than conventional packages.

Leading manufacturers including Samsung, ASE, Amkor, and TSMC are expanding their PLP roadmaps. Yet significant challenges remain — from glass substrates and temporary bonding to die shift and warpage. These challenges are interconnected and cannot be solved in isolation. What the industry needs is a more integrated panel-level process.

As a pioneer in PLP, ERS developed its first manual FOPLP machine in 2018. Since then, we have worked closely with leading research institutes to explore and advance panel-level processes.

🗓️Next Thursday, August 27, our Senior System Architect Mehdi Farhat will be at Hsinchu Science Park to share how we have supported the transition from wafer- to panel-level packaging and present our latest innovations in PLP.

Join us to exchange insights on the future of panel-level packaging. We look forward to seeing you in Hsinchu!

17/08/2026

SEMICON Taiwan 2026 is just two weeks away! This year, we’re putting the spotlight on our solutions, from to correction. Our colleagues will be at the booth throughout the show, ready to exchange ideas and discuss the latest challenges and innovations in advanced packaging.
📅September 2–4
📍TaiNEX Hall 1, Level 4, Booth M0257
See you soon in Taipei!

11/08/2026

🚀 As device architectures evolve toward integration and designs, semiconductor manufacturing relies increasingly on specialized process technologies to extend Moore’s Law and optimize power, performance, area, and cost.

Advanced packaging, spanning Fan-In, Fan-Out, 2.5D, and architectures, depends entirely on precision process ex*****on. High-aspect-ratio TSVs and ultra-fine demand tightly controlled deposition, electrochemical plating, wet processing, and surface preparation. Meanwhile, scaling to -Level Packaging introduces complex material handling, thermal stress, process integration, and warpage challenges.

🤝 Meet us at the Advanced Packaging Forum 2026 organized by 新電子科技雜誌 in Hsinchu, Taiwan!

Join our Senior System Architect for a presentation on: “From Wafer to Panel: Controlling Warpage, Thermal Stress and Temporary Bonding for Mass Production”

📅 August 27 | 15:10 CST
📍 Hsinchu Science Park

We look forward to exchanging ideas with industry peers and exploring how process-driven innovations can help make AI packaging scalable and reliable for mass production.

06/08/2026

We're at the 27th International Conference of Electronic Packaging Technology (ICEPT 2026) in Xi'an, China, and tomorrow is the last day! 🚀
Don't miss your final opportunity to meet our Advanced Packaging Engineer to discuss our wafer- and panel-level debonding and warpage handling solutions!

Adresse

Stettiner Str. 3+5
Germering
82110

Telefon

+49898941320

Webseite

http://www.ers-gmbh.com/

Benachrichtigungen

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