05/06/2026
Glass can play multiple roles in advanced packaging.
In some processes, it acts as a carrier, supporting wafer thinning and fan-out wafer-level packaging with the stability, transparency, and geometric accuracy needed for precise handling and inspection.
In others, glass becomes part of the package architecture itself.
As glass-core substrates, glass panels can enable high-density interconnections for chips and passive components. They support through-glass via formation, precise microstructuring, and high-performance metallization, while offering strong surface quality, high stiffness, tunable thermal expansion, and beneficial electrical properties.
Our Semicon Glass Solutions team supports both: glass carriers for reliable semiconductor processing, and glass panels for next-generation advanced packaging architectures.
Because in advanced packaging, glass is more than a single solution. It’s a platform for multiple process steps, package designs, and performance requirements.
Learn more: https://bit.ly/4ubbRw4