08/06/2026
Introducing TG-AD30D Low Outgassing Thermal Pad:
T-Global Technology is pleased to announce the launch of the new TG-AD30D, an advanced low-outgassing thermal pad designed for applications where thermal performance, reliability, and material stability are critical.
Engineered to ASTM E595 standards for demanding applications across aerospace, AI infrastructure, datacom, automotive electronics, energy storage, military systems, and advanced industrial equipment, TG-AD30D helps manufacturers address thermal challenges without compromising long-term system reliability.
With a thermal conductivity of 3.0 W/mK, low thermal impedance and excellent electrical insulation properties, TG-AD30D is optimised for high-power applications requiring efficient heat transfer and dependable mechanical compliance with minimal outgassing.
TG-AD30D extends our hybrid thermal pad portfolio with a material specifically developed for applications where outgassing performance is a major design consideration, this product enables customers to achieve reliable thermal management in increasingly sensitive and high-performance electronic systems.
Find out more: https://www.tglobaltechnology.com/2026/06/03/low-outgassing-thermal-pad-launched/
