23/10/2026
EEA shortlist 2026: Adeia 🎉
We are pleased to announce that Adeia’s reworkable die-to-wafer hybrid bonding has been shortlisted for the Electronics Excellence Awards under the Semiconductor category.
Adeia’s reworkable die-to-wafer (D2W) hybrid bonding processes make it possible to remove and replace defective die after hybrid bonding, addressing one of the technology’s most critical pain points.
Find out more here: https://www.electronicspecifier.com/news/awards/eea-shortlist-2026-adeia/