SNTPCB focus on high-quality and economically viable systems combined with providing one turnkey stop for infinite solutions from PCB/PCBA Manufacturing and Electronic Components Supply to build your state-of-the-art PCBs. [SNT Business]
PCB (Printed Circuit Board)/Printed Cicrcuit Board Assembly (PCBA) Manufacture/OEM/CMO, Electronic Parts (Diode, LED, Resistor, Capacitors, Switches, Inductors, B
attery, etc) Supply
[SNT Capability]
Layers: 1-28 Layers
Thicker Copper: 1-6 oz
Products Type: HF (High-Frequency) & (Radio Frequency) board,
Imedance controlled board, HDI board, BGA & Fine Pitch board
Solder Mask: Nanya & Taiyo, LPI & Matt red, green, yellow, white, blue, black. Base Material FR4 (Shengyi China, ITEQ, KB A+,HZ), HI-TG, Fr06, Rogers, Taconic, Argon, Naclo, Isola and so on
Finished Surface: Conventional HASL, Lead-Free HASL, Flash Gold, ENIG (Immersion Gold), OSP (Entek), Immersion Tin, Immersion Sliver, Hard Gold
Selective Surface Treatment: EING(Immersion Gold)+OSP, ENIG(Immersion Gold)+Gold Finger, Flash Gold Finger, Immersion Sliver+Gold Finger, Immersion Tin+Gold Finger
[Technical Specification]
Minimum Line Width/Gap: 3.5/4 mil (Laser Dirll)
Minimum Hole Size: 0.15mm (Mechanical Dirll) 4mil(Laser Dirll)
Minimum Annular Ring: 4 mil
Max Copper Thickness: 6 oz
Max Production Size: 600 mm x 800 mm
Board Thickness: D/S: 0.2-7.0 mm
Multilayer: 0.40-7.0 mm
Min Solder Mask Bridge: ≥0.08 mm
Aspect Ratio: 15:1
Plugging Vias Capability: 0.2-0.8 mm
[Tolerance]
Plated Holes Tolerance: ±0.08 mm(Min±0.05)
Non-Plated Hole Tolerance: ±0.05 mm (Min+0/-0.05 mm or +0.05/-0 mm)
Outline Tolerance: ±0.15 mm(Min±0.10 mm)
Insulating Resistance: 50 ohms (Normality)
Peel Off Strength: 1.4 N/mm
Thermal Stress Test: 265 Celsius, 20 seconds
Solder Mask Hardness: 6 H
E-test Voltage: 500 V+15/-0V 30s
Warp and Twist: 0.7% (Semiconductor Test Board 0.3%)
