29/04/2026
As AI performance continues to advance, thermal management has become a critical technology🔥
Thermal Interface Materials (TIMs) are widely used between heat-generating components and heat spreaders, heat sinks, cold plates, and enclosures to reduce thermal resistance and improve heat transfer. As electronic systems become smaller, faster, and more power-dense, thermal control is no longer a secondary design consideration—it is now a strategic requirement for product reliability, chip performance, battery safety, data center uptime, and telecom network efficiency.
Nexteck ceramic heat sinks offer high thermal conductivity, electrical insulation, and excellent stability, effectively addressing the high heat density challenges of AI chips. They are widely applied in AI servers and automotive electronics.
