Nexteck

NEXTECK is major a supplier of carrier tape, cover tape and dicing tape for semiconductor; also Alloy

立承德科技专业于电子等高技产业之材料的供应。

在今日能源匮乏的年代，我们专注于开创电子产业之全方位的材料供应链，我们竭诚欢迎任何人与我们一同开创新的市场价值

23/09/2026

從先進合金、陶瓷材料到半導體相關材料，Nexteck 持續與全球客戶及合作夥伴攜手，提供可靠的材料解決方案，支持高科技產業持續向前發展。

感謝一路同行的每一位客戶與合作夥伴，因為彼此的信任與合作，讓每一次連結都更有價值。

🌕 Nexteck 祝您中秋佳節愉快！
願月圓、人安、事順，與家人共享美好團圓時光。

#中秋節

07/08/2026

稀土供應趨緊，正為高階氮化鋁（AlN）陶瓷產業帶來新的挑戰。

稀土氧化物是 AlN 陶瓷燒結的重要添加材料，可提升導熱性、緻密度與可靠性，廣泛應用於半導體封裝、光通訊及高功率電子元件。

隨著市場需求持續成長，供應鏈韌性與材料穩定供應將成為高階陶瓷產業的重要課題。

20/07/2026

AI带动先进封装升级，切割胶带需求成长
AI快速发展正推动半导体产业进入全链整合时代。根据Counterpoint Research报告，Foundry 2.0市场涵盖晶圆制造、封装、测试及光罩等相关领域，去年市场规模达3,200亿美元，年成长16%。
随着AI芯片效能需求提升，先进封装已成为影响芯片效能、整合能力与量产效率的关键环节。立承德致力提供高性能晶圆切割胶带解决方案，协助半导体制造商提升晶圆切割制程稳定性，满足先进封装与高阶半导体应用需求。
#先进封装 #晶圆切割 #切割胶带 #半导体材料 #封装测试

09/07/2026

SEMICON Taiwan 2026

展覽日期｜ 2026年9月9日–11日
展覽地點｜台北南港展覽館（TaiNEX 1 & 2）

SEMICON Taiwan 是亞洲領先的半導體展覽之一，匯聚全球半導體產業領導者、創新技術與最新市場趨勢。展會聚焦先進製造、異質整合、化合物半導體、車用晶片、智慧製造、永續發展及半導體資安等關鍵領域，成為推動技術交流與產業合作的重要平台。

作為連結全球半導體供應鏈的重要展會，SEMICON Taiwan 提供業界探索前瞻技術、交流產業趨勢及掌握最新解決方案的絕佳機會。

#半導體 #散熱材料

23/06/2026

🚀【TAITRONICS & AIoT Taiwan 2026】🚀

2026年以「Edge Intelligence Now」為主題，聚焦 AIoT、邊緣運算與智慧電子產業發展。

隨著 AI 運算需求快速成長，高效散熱已成為關鍵技術之一。立承德提供多元 TIM 散熱介面材料解決方案，協助提升設備散熱效能與運作穩定性，滿足 AI Server、電源模組及高功率電子設備應用需求。

#散熱材料 #立承德 #熱管理

17/06/2026

粽葉飄香迎端午，立承德感謝各位客戶與合作夥伴一路以來的支持與信任。
值此佳節之際，祝福大家：端午安康，闔家平安

#立承德 #端午節快樂 #端午安康 #健康平安 #感恩有您

29/04/2026

As AI performance continues to advance, thermal management has become a critical technology🔥

Thermal Interface Materials (TIMs) are widely used between heat-generating components and heat spreaders, heat sinks, cold plates, and enclosures to reduce thermal resistance and improve heat transfer. As electronic systems become smaller, faster, and more power-dense, thermal control is no longer a secondary design consideration—it is now a strategic requirement for product reliability, chip performance, battery safety, data center uptime, and telecom network efficiency.

Nexteck ceramic heat sinks offer high thermal conductivity, electrical insulation, and excellent stability, effectively addressing the high heat density challenges of AI chips. They are widely applied in AI servers and automotive electronics.

01/04/2026

How Advanced Ceramics Power Next-Gen Electronics

Electronics have evolved from bulky systems to compact, high-performance devices. As size shrinks, demands for higher speed and power density continue to grow.

At NEXTECK, advanced ceramics play a critical role—delivering excellent insulation, thermal management, and structural stability to ensure reliable performance in modern electronic applications.

04/02/2026

We sincerely thank all our valued partners for your trust, support, and cooperation over the past year.
Looking ahead, we look forward to continuing our collaboration and achieving even greater success together in 2026.
#2026

17/12/2025

🎄 Merry Christmas from Nexteck 🎄

Thank you for your continued trust and support throughout the year.
We look forward to advancing ceramic material solutions together in the year ahead.

Wishing you a joyful Christmas and a successful New Year. ✨
— Nexteck Team

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Hong Kong

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http://www.nexteck.com/

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