30/04/2026
Weekly IT News Digest — gathered the main events of the week in one post:
1️⃣ Google plans to invest up to $40 bn in Anthropic. $10 bn will be provided upfront, with the remaining $30 bn to be released as the company meets undisclosed performance milestones. Google has previously invested over $3.75 bn in the generative AI developer and is also funding a number of data centers to host the startup’s infrastructure. Earlier this year, Anthropic signed an agreement with Broadcom and Google to supply 3.5 GW of TPU chips, which are expected to launch starting in 2027.
🔗 https://www.datacenterdynamics.com/en/news/google-plans-to-invest-up-to-40bn-in-anthropic/
2️⃣ Intel and AMD are developing the ACE (AI Compute Extensions) initiative. ACE is planned to become the standard architecture for accelerating matrix computations on x86 chips and will significantly boost the performance of AI tasks. The project is part of the companies’ joint strategy to unify the x86 ecosystem within the x86 Ecosystem Advisory Group. In addition to ACE, the roadmap includes FRED, AVX10, and ChkTag technologies, designed to standardize key processor functions and simplify software development.
🔗 https://wccftech.com/amd-intel-ace-partnership-boosts-ai-performance-standard-matrix-acceleration-architecture-for-x86/
3️⃣ TSMC accelerate the development of its 2nm process technology bringing five advanced fabs online. The volume of 2nm production is expected to be nearly double that of 3nm. It was previously reported that TSMC plans to significantly increase the production of 2nm and 3nm wafers by the end of 2026 in response to demand from key customers.
🔗 https://wccftech.com/tsmc-doubles-down-on-2nm-five-fabs-ramping-at-once-output-eclipse-3nm-by-2x/
4️⃣ Intel and Amkor Technology plan to bring glass substrate technology to market. The technology is expected to be available within the next three years. Glass substrates are thin sheets of special glass used as a base for mounting integrated circuits or placing electronic components. They are viewed as an alternative to advanced packaging solutions, including CoWoS.
🔗 https://wccftech.com/intel-backed-glass-substrates-tech-will-be-commercilization-ready-within-three-years/
5️⃣ Nvidia announced the Groq 3 LPX accelerator, delivering up to a 35x increase in AI inference performance. Foxconn will be the key supplier of racks for the new solution. The new racks will include up to 256 chips with 128 GB of SRAM and 12 TB of DDR5 memory. This design is geared toward processing models with trillions of parameters.
🔗 https://wccftech.com/nvidia-35x-ai-inferencing-leap-arrives-early-foxconn-fast-fowards-groq-3-lpx-racks/
