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PHIX Photonics Assembly

Name: PHIX Photonics Assembly
Address: Hengelosestraat 525, Enschede, 7521AG, NL
Telephone: +31534836850
Price range: ££

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Enschede
PHIX Photonics Assembly

PHIX is a world leading independent contract manufacturer for photonic chip packaging, headquartered in The Netherlands.

We specialize in the manufacturing of hybrid assemblies, using multiple chip materials and fiber arrays to create maximum functionality. By offering our knowledge in the chip design stage, we ensure ease of scale up for volume manufacturing. Chip-to-chip and fiber-to-chip interfaces, polarization maintaining fiber assemblies and high-power applications are among our core competencies. From PIC pro

totype to assembly and scale-up to high-volume manufacturing: PHIX is your partner in photonics. We offer a one-stop-stop fully tailored to your needs. That’s how we prepare your products for tomorrow’s society, today.

03/06/2026

Photonics-enabled wireless communication is taking big steps forward!

This module developed as part of the European TERA6G research project combines , advanced , and THz antenna arrays into a unified system, demonstrating a clear path toward terabit-per-second (Tbps) wireless data transmission.

Read our new to learn more about the project's latest developments, the contributions of our consortium partners*, and the exciting applications for this wireless technology!

➤ Blog: https://www.phix.com/advancing-photonic-terahertz-wireless-communication/

* Shootout to our partners: Cumucore, LioniX International, Telefonica, Universidad Carlos III de Madrid, Fraunhofer Heinrich-Hertz Institute, University of Piraeus Research Center, LeapWave Technologies, Institute of Communications & Computer Systems, Oulun Yliopisto, and Intracom Telecom Solutions.

𝘛𝘩𝘪𝘴 𝘸𝘰𝘳𝘬 𝘪𝘴 𝘱𝘢𝘳𝘵 𝘰𝘧 𝘵𝘩𝘦 𝘛𝘌𝘙𝘈6𝘎 𝘱𝘳𝘰𝘫𝘦𝘤𝘵, 𝘸𝘩𝘪𝘤𝘩 𝘩𝘢𝘴 𝘳𝘦𝘤𝘦𝘪𝘷𝘦𝘥 𝘧𝘶𝘯𝘥𝘪𝘯𝘨 𝘧𝘳𝘰𝘮 𝘵𝘩𝘦 𝘌𝘶𝘳𝘰𝘱𝘦𝘢𝘯 𝘜𝘯𝘪𝘰𝘯’𝘴 𝘏𝘰𝘳𝘪𝘻𝘰𝘯 𝘌𝘶𝘳𝘰𝘱𝘦 𝘳𝘦𝘴𝘦𝘢𝘳𝘤𝘩 𝘢𝘯𝘥 𝘪𝘯𝘯𝘰𝘷𝘢𝘵𝘪𝘰𝘯 𝘱𝘳𝘰𝘨𝘳𝘢𝘮 𝘶𝘯𝘥𝘦𝘳 𝘨𝘳𝘢𝘯𝘵 𝘢𝘨𝘳𝘦𝘦𝘮𝘦𝘯𝘵 𝘯𝘰. 101096949.

02/06/2026

Last Thursday, a small group of PHIX employees traded desks for dirt trails during a mountain biking adventure through the beautiful countryside!

Under perfect spring skies, we rode through forests, across fields, alongside streams, and even crossed briefly into Germany. Although the ride was bumpy at times, everyone made it back relatively unharmed, apart from a few small bruises, some tired legs, and sore bums!

The PHIX Staff Association regularly organizes a variety of activities like this to encourage social connection and outside of work hours. Another great day of adventure, exercise, and good company!

28/05/2026

Congratulations to Jelmer Bellert for successfully completing his at PHIX! Cum laude!

His project, part of the Master Applied Nanotechnology at Saxion University of Applied Sciences, included process development for lowering the thermocompression bonding temperature for integrating PICs with electro-optical PCBs.

Directly aiding cutting-edge research for the international POLYNICES consortium, Jelmer's work contributed to advancing photonic integration for applications like and .

Amazing job, Jelmer!

26/05/2026

Let's talk at Optica's Quantum 2.0 event in Glasgow, UK, next month!

Meet our sales director Marcel van Veen at booth 402 and discover PHIX's scalable ultra low-loss packaging solutions for quantum applications such as , computing, and sensing, including assemblies that withstand cryogenic conditions.

We look forward to meet you!

21/05/2026

Did you know that we offer a plug-and-play solution for our characterization packages?

Our PHIX Cooling Carriers serve two purposes:
● To position thermoelectric coolers (TECs) underneath module housings to regulate PIC temperatures.
● To enable easy mounting of our modules on optical tables, for quick system integration.

In combination with the thermistor already integrated in the package, and a TEC controller (sold separately), the PIC's temperature can be kept at a constant value to stabilize its operating conditions.

Pictured here is the PHIX Cooling Carrier XL, which fits our PHIX RF Characterization Package, an open architecture rapid prototyping solution for PICs that require RF electronic connectivity.

➤ More about on our Cooling Carriers: https://www.phix.com/support/support-phix-characterization-package/cooling-carrier/

19/05/2026

Semiconductor packaging these days is as much about as it is about . That's why the Electronic Components and Technology Conference (ECTC) covers many PIC related topics, such as heterogeneous integration and co-packaged optics ( ).

At this year's ECTC in Orlando (FL) on May 26-29, PHIX photonics packaging experts Jeroen Duis and Bradley Snyder will be present to join the discussions and facilitate on-site meetings.

Would you like to have a chat about scalable packaging solutions and industrialized assembly processes at the intersection of photonics and electronics?

➤ Then get in touch here: https://www.phix.com/event/electronic-components-and-technology-conference-ectc/

16/05/2026

It's the International Day of Light 16 May!

Every year on May 16, we celebrate the anniversary of the first successful operation of the laser in 1960, and all the amazing applications that it brought about. Think high-speed , medical diagnostics, autonomous driving, , and many more!

Did you know that most light used in integrated is not in the visible spectrum?
View the images to find out why!

13/05/2026

Yesterday, PHIX had the pleasure of hosting the 11th general meeting of the PUNCH consortium!

This collaborative research effort of imec, NVIDIA, PHIX, Ericsson, AT&S, Fraunhofer IZM, and the University of Cambridge develops key technologies for next-generation co-packaged optics ( ) and ultra-high-speed optical interconnects for the of the future. The project enables PHIX to develop novel fiber array attachment and flip-chip die bonding techniques to serve this flourishing market.

It was great to meet face to face and align on progress and the next milestones. We're excited to see our combined innovations move closer to real-world deployment!

𝘛𝘩𝘦 𝘗𝘜𝘕𝘊𝘏 𝘱𝘳𝘰𝘫𝘦𝘤𝘵 𝘩𝘢𝘴 𝘳𝘦𝘤𝘦𝘪𝘷𝘦𝘥 𝘧𝘶𝘯𝘥𝘪𝘯𝘨 𝘧𝘳𝘰𝘮 𝘵𝘩𝘦 𝘌𝘶𝘳𝘰𝘱𝘦𝘢𝘯 𝘜𝘯𝘪𝘰𝘯’𝘴 𝘏𝘰𝘳𝘪𝘻𝘰𝘯 𝘌𝘶𝘳𝘰𝘱𝘦 𝘙𝘦𝘴𝘦𝘢𝘳𝘤𝘩 𝘢𝘯𝘥 𝘐𝘯𝘯𝘰𝘷𝘢𝘵𝘪𝘰𝘯 𝘗𝘳𝘰𝘨𝘳𝘢𝘮𝘮𝘦 𝘶𝘯𝘥𝘦𝘳 𝘎𝘳𝘢𝘯𝘵 𝘈𝘨𝘳𝘦𝘦𝘮𝘦𝘯𝘵 𝘕𝘰 101070560.

12/05/2026

Attention, innovators! The submission deadline for the Global Photonics Engineering Contest 2026 is approaching fast.

If you have an innovative idea for harnessing integrated to solving a real-world societal challenge, this , organized by PhotonDelta and Wevolver.com, is your opportunity to make impact!

As a jury member and technology partner, PHIX contributes both deep industrial expertise and a share of the €100k in technology services that help the winning team accelerate their innovation from concept to industrial maturity. Furthermore, the winner may qualify for up to €2M in pre-seed funding, providing a strong runway toward commercialization.

The stage is still open until the deadline of June 19th, for innovative PIC-based solutions targeting safety, , advanced , or another high-impact domain.

Don't miss this opportunity to bring your idea to industrial fruition!

➤ Learn more and enter: https://www.wevolver.com/article/global-photonics-engineering-contest-2026

07/05/2026

Following two very successful episodes of the photonixFAB series on packaging, the final chapter is coming up!

And this time, on Thursday May 21st 14:00 CET, PHIX product manager Andrea Alippi will be fighting the boss battle! 💀
Because the topic of his lecture will be advanced packaging challenges and solutions, involving demanding applications that require high performance and long-term stability. Think high-power optical interfaces, harsh environmental conditions, and strict reliability standards.

Don't miss this free opportunity to learn from a true PIC packaging expert!

➤ Register for free: https://www.phix.com/three-webinars-photonics-packaging

Adres

Hengelosestraat 525
Enschede
7521AG

Openingstijden

Maandag	09:00 - 17:00
Dinsdag	09:00 - 17:00
Woensdag	09:00 - 17:00
Donderdag	09:00 - 17:00
Vrijdag	09:00 - 17:00

Telefoon

+31534836850

Website

https://www.phix.com/

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