27/05/2026
🚨 𝐋𝐀𝐒𝐓 𝐂𝐀𝐋𝐋 𝐅𝐎𝐑 𝐏𝐀𝐏𝐄𝐑𝐒 – 𝐈𝐍𝐓𝐄𝐑𝐂𝐎𝐍 𝟐𝟎𝟐𝟔 🚨
Can your research shape the future of engineering, technology, and innovation?
Be part of the 𝟑𝟑𝐫𝐝 𝐄𝐝𝐢𝐭𝐢𝐨𝐧 𝐨𝐟 𝐈𝐍𝐓𝐄𝐑𝐂𝐎𝐍, one of the leading international IEEE conferences. 🌎⚡
⏳ 𝐅𝐮𝐥𝐥 𝐏𝐚𝐩𝐞𝐫 𝐒𝐮𝐛𝐦𝐢𝐬𝐬𝐢𝐨𝐧 𝐃𝐞𝐚𝐝𝐥𝐢𝐧𝐞: June 22nd, 2026
📥 𝐒𝐮𝐛𝐦𝐢𝐭𝐭 𝐧𝐨𝐰:: https://easychair.org/conferences/?conf=intercon2026
🌐 𝐅𝐨𝐫 𝐟𝐮𝐥𝐥 𝐝𝐞𝐭𝐚𝐢𝐥𝐬: https://www.intercon.org.pe/CallforPapers
🎯 Also, join the 𝐌𝐮𝐥𝐭𝐢-𝐓𝐞𝐜𝐡 𝐂𝐡𝐚𝐥𝐥𝐞𝐧𝐠𝐞 𝟐𝟎𝟐𝟔 and showcase your talent in a multidisciplinary engineering competition 👉 https://intercon.org.pe/competitions.html
✔️ Robotics and Hardware
✔️Software and Artificial Intelligence
✔️ Optimization and Industrial Impact
📍 𝐋𝐨𝐜𝐚𝐭𝐢𝐨𝐧: Universidad Privada Antenor Orrego, Trujillo – Peru
📅 𝐂𝐨𝐧𝐟𝐞𝐫𝐞𝐧𝐜𝐞 𝐃𝐚𝐭𝐞𝐬: August 12th–14th, 2026
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