05/05/2026
Introducing the Daira Sub-GHz Module, built for developers who demand more from their wireless hardware.
We didn't build this module to check spec boxes. We built it because the wireless IoT market deserved a platform that handles real-world deployment challenges, frequency constraints, firmware complexity, thermal stress, EMI compliance, and protocol fragmentation, all in one compact, production-ready package.
Here's what makes it different:
1. Dual-band RF (826–958 MHz & 413–479 MHz), open field range and urban wall pe*******on, covered by a single module without hardware changes.
2. STM32WL33CC with full 48-pin access, every interface your design needs, from first prototype to final production variant, without a board redesign.
3. 256 KB Flash + 32 KB RAM, validated with FreeRTOS under real concurrent workloads. Enough headroom for OTA updates, complex protocol stacks, and application logic running together.
4. VFQFPN48 thermal package, engineered for long-term reliability in industrial, outdoor, and high-duty-cycle environments.
5. Full modulation suite + Sigfox, Mioty & IEEE 802.15.4g, when your network architecture changes, only your firmware changes. Not your hardware.
6. Integrated LCD driver, 12×8 and 16×4 matrix support built in. Fewer components, simpler BOM, faster time to market.
7. 4-layer PCB + 50Ω impedance + Frada Cage EMI shielding, first-pass CE, FCC, and ARIB certification performance, without the last-minute layout scramble.
Whether your team is building smart utility meters, industrial sensors, agricultural automation, or connected home devices, this module is the foundation that gets you there faster, and keeps you there longer.
🔗 Explore the full module: https://www.dairaengineering.com/caseStudy/69f3001cdf48db789125e393
📖 Read the case study: 1. https://www.dairaengineering.com/posts/69f1eab6e356895d2d827e92
2. https://www.dairaengineering.com/posts/69f9930aa005c2f9ad390eb3