09/09/2026
Trying to balance thermal performance, dimensional stability and weight in the same component?
Then ECOC 2026 is a great opportunity to meet the experts behind Osprey® CE alloys and discuss your challenges in person.
From optical housing to electronic packaging, Osprey® CE alloys help address thermal expansion challenges while maintaining dimensional stability and low weight.
Meet Zachariah Nye and Shazi Sheikh at booth 1409 to learn more. They would love to hear what you’re working on.