WT Microelectronics Singapore Pte. Ltd.

20/06/2026

Nuvoton Strengthens Tethered XR Glass SoC Business Through Collaboration With Qualcomm Technologies.

Nuvoton Technology Corporation announced that it has agreed to collaborate with Qualcomm Technologies, Inc. on system-on-chip (SoC) products primarily targeting tethered XR Glass applications. Through this collaboration, Nuvoton will combine its tethered XR Glass–optimized SoCs with Snapdragon® XR platforms, and its software ecosystem to accelerate the development and deployment of tethered XR Glass applications and to support industry expansion.

Snapdragon

20/06/2026

That's a wrap on , Detroit, USA🔙🚀
We had great 3-days filled with impactful conversations, strong partner validation, and exciting new connections.

Thanks to and Smart Eye for bringing our booth to life with live demos showcasing our Automotive CMOS image sensors in action.

AutoSens

19/06/2026

In today’s competitive landscape, a high-performance charger isn’t just an advantage—it’s a necessity. Whether you’re an engineer, design specialist, or industry decision-maker, this webinar will provide you with practical insights, real-world data, and ST’s cutting-edge 3-phase PFC solutions to take your EV chargers to the next level.

🖥️ Join now for the FREE webinar
🔗 Register here: http://spkl.io/61857DjMb

19/06/2026

SerDes is the foundational building block of high-speed networking, present in every XPU, switch, high-speed interface, and optical component in a modern data center. Its performance has a direct impact on power consumption, latency, bandwidth, link length, and ultimately total cost of ownership.

Marvell has doubled the line speed of its leading SerDes approximately every two years. The most recent demonstration of 224G long-range SerDes achieved lane bit error rates of 1e-11 at 4 picojoules per bit across a 2.5-meter CPC-backplane-CPC channel, with up to 512 lanes integrable into a 102.4T switch.

Senior Staff Engineer Aatreya Chakravarti explains how the technology works, where it fits within the broader connectivity stack, and why SerDes leadership remains central to scaling AI infrastructure: https://mrvl.co/44fVLXD

18/06/2026

Contemporary silicon photonics modulators are constrained by the diffraction limit of light, restricting their ability to scale efficiently to the bandwidths AI infrastructure will require. Plasmonics offers a path forward.

By compressing light below the diffraction limit at a metal-dielectric interface, plasmonic modulators can operate at speeds exceeding 1 THz, more than 10x faster than conventional photonic modulators, while measuring approximately 10 microns in length, 300x to 500x shorter. The result is exponentially higher bandwidth density within the same silicon photonics platform, without requiring a shift to new material systems.

Marvell Senior Director Claudia Hoessbacher and Director Wolfgang Heni of Optical Engineering detail the technology, its applications across scale-up and scale-across networks, and where development stands today.

Read more: https://mrvl.co/4a8nRaK

17/06/2026

Deploying next-generation optical connectivity at the pace AI infrastructure demands requires more than advanced technology. It requires standards that reduce integration complexity and give data center operators flexibility at the time of deployment.

The Open CPX MSA, which includes Marvell among its members, is building that foundation. A single CPX array can be configured to support co-packaged copper for intra-rack connections, co-packaged optics for rack-to-rack communication, and ZR/ZR+ modules for long-distance interconnects, with port configurations determined at deployment rather than at design time.

With near- and co-packaged port shipments projected to grow from under one million in 2025 to more than 100 million per year by 2030, that kind of flexibility matters. George Hervey explains what Open CPX makes possible: https://mrvl.co/4emX2Ro

16/06/2026

🚘As vehicles evolve toward zonal and software-defined architectures, in-cabin audio distribution is becoming more flexible and scalable through Ethernet.

🔍This use case shows how Audio over Ethernet can simplify system design while maintaining synchronization, timing, and audio quality across the audio chain. It highlights a reference solution based on ST hardware, software integration, validation elements, and system-level building blocks, helping developers move from proof of concept to production-ready zonal audio architectures

Discover now➡️http://spkl.io/61847Db1k

16/06/2026

Editor's Note: ITTIA will hold a series of workshops over the coming weeks focusing on its solutions and STM32 platforms. Check out the links at the end of

16/06/2026

In an exclusive interview with DIGITIMES at Computex 2026, Marvell President and Chief Operating Officer Chris Koopmans covered a lot of ground: the company's decade-long transformation into a data infrastructure leader, why securing supply chain capacity is ultimately about trust, and how the transition from copper to optical will unfold over the next five years in scale-up networks.

On the copper wall: "The copper wall will eventually fall." On the ASIC business: it is fundamentally an I/O business, not an XPU business. And on supply constraints: the current environment may actually be healthier for the long-term trajectory of the AI industry than unconstrained growth would be.

A substantive read for anyone tracking where AI infrastructure is headed: https://mrvl.co/4eKstGA

15/06/2026