28/05/2026
Before a multilayer PCB can form precise circuit patterns, proper panel cutting and pre-treatment are essential.
In the PCB inner layer process, copper clad laminates are first cut into production panels, followed by surface cleaning, scrubbing, and micro-etching to prepare the copper surface for dry film lamination.
Why is this important?
✅Improves dry film adhesion
✅Removes oxidation and contamination
✅Enhances imaging accuracy
✅Reduces defects during etching
✅Improves multilayer PCB reliability
Even small surface contaminants can affect circuit quality and long-term performance. Proper pre-treatment helps ensure stable manufacturing results for HDI, multilayer, and high-reliability PCB applications.
🕵️♀️Learn more about the PCB inner layer process: https://www.explus.com.tw/faq/Inner-Layer-Process-I-Panel-Cutting-and-Pre-Treatment.html