NHanced Semiconductors, Inc.

10/09/2026

Counterfeit microelectronics aren’t just a reliability problem. They’re a security risk.

A counterfeit component can be substandard and compromise the stability of a system. In more serious cases, malicious components could potentially be used to introduce vulnerabilities into the systems where they’re deployed.

So how can we detect them?

At the SMTA Symposium on Counterfeit Parts and Materials, NHanced Semiconductors’ Charles Woychik presented an approach for using AI-enhanced physical inspection to help identify counterfeit microelectronics.

By combining advanced inspection techniques with AI, we can move toward more effective ways to verify components and strengthen the security of critical systems.

Read the presentation and explore the approach:

https://nhanced-semi.com/2026/06/11/ai-enhanced-physical-inspection-for-counterfeit-microelectronics/

10/05/2026

The semiconductor industry is reaching the limits of traditional scaling. So what comes next?

Not just scaling down — building up!

In a new Siemens Digital Industries Software feature, our President Bob Patti shares his perspective on the growing role of 3D IC and heterogeneous integration, and how the industry can continue pushing performance beyond the limits of conventional silicon scaling.

From chiplet systems to advanced multi-level architectures, the next era of semiconductor innovation is taking shape in the third dimension.

Read the full story and hear Bob’s insights on where 3D IC is headed:
https://blogs.sw.siemens.com/semiconductor-packaging/2026/09/17/beyond-the-limits-of-silicon-why-3d-ic-is-the-next-frontier-of-innovation/

09/29/2026

What will it take to enable the next generation of multi-terabit photonic systems?

NHanced Semiconductors President Bob Patti will explore that question in his invited talk, “3D Photonic Integration: Enabling Multi-Terabit Operation,” at the 2026 IEEE International 3D Systems Integration Conference (3DIC).

Bob will discuss how advances in advanced packaging are enabling new approaches to photonic integration—from improved device alignment and chipletization to heterogeneous integration and the miniaturization and co-location of photonic circuit elements.

He’ll also join industry leaders from TSMC, Siemens EDA, and Zero ASIC for a panel discussion on “The Self-Sustaining Economics of a Truly Open Chiplet Market,” moderated by Paul Franzon of NC State University.

We’re looking forward to the conversations shaping the future of advanced packaging, photonics, and open chiplet ecosystems at 3DIC 2026.

09/14/2026

How do we push hybrid bonding to the ultra-fine pitches needed for the next generation of AI and high-performance computing?

That’s the question NHanced Semiconductors, the University of Florida, and Besi will explore at the 2026 IMAPS Symposium.

NHanced’s Vice President Dr. Charles Woychik, alongside equipment vendor Besi and Dr. Navid Asadizanjani's University of Florida team, will present “Technical Challenges for Ultra Fine Pitch Hybrid Bonding,” examining the barriers and emerging solutions behind the next generation of heterogeneous integration.

Ultra-fine pitch hybrid bonding is increasingly critical as AI, advanced memory, photonics, and quantum computing demand greater interconnect density, shorter signal paths, and higher performance.

The presentation will explore challenges including alignment accuracy, surface preparation, materials and process integration, thermal considerations, equipment capabilities and reliability

IMAPS Symposium | Boston, MA --
September 28–October 1, 2026

We’re excited to contribute to the conversation around intelligent packaging for the AI era and the future of heterogeneous integration.

09/08/2026

What will it take to power the next generation of AI and high-performance computing?

Advanced packaging will play a critical role.

Join Chuck Woychik of NHanced Semiconductors, Inc., a QCi company, at the 37th Electronics Packaging Symposium at Binghamton University, where he’ll present “Advanced Packaging for AI/HPC” as part of:

📍 Session 6: The Future of Computing for HPC/AI
📅 Thursday, September 10
⏰ 11:10 – 11:40 AM

Chuck will explore how advanced packaging technologies are helping address the evolving demands of AI and HPC and enabling new possibilities for the future of computing.

We hope to see you there!

08/20/2026

We’re excited to share that NHanced Semiconductors, a QCi Company, will be presenting at SMTA International 2026 alongside researchers from the University of Florida.

NHanced Vice President Dr. Charles Woychik and Dr. Navid Asadizanjani of the Florida Semiconductor Institute will present:

“Advanced Packaging for Photonics: Hybrid Bonding and Silicon Interposer Integration.”

As photonic systems continue to scale for high-bandwidth applications, including co-packaged optics and AI interconnects, advanced packaging is becoming increasingly critical. The presentation will explore how Cu-Cu hybrid bonding and high-density silicon interposers can enable 2.5D heterogeneous integration of chiplets, supporting higher-density, more energy-efficient photonic-electronic systems.

The team will also highlight key challenges in areas such as bonding defectivity, alignment accuracy, thermal management, and materials integration, as well as the opportunities these technologies create for next-generation photonic and AI infrastructure.

We look forward to sharing our work and connecting with others advancing the future of semiconductor packaging, photonics, and AI interconnects.

Fine-pitch Cu-Cu hybrid bonding and high-density silicon interposers enable 2.5D heterogeneous chiplet integration for silicon photonics

08/11/2026

A press release from our parent, QCi -- link in first comment

07/27/2026

In today's chips, most of the power and time are consumed by interconnect -- "wire" -- rather than by active silicon. In addition, most of the silicon area is consumed by components that are idle. Advanced packaging meaningfully addresses both of these problems.

Bob Patti discusses this with Tova Levy of Siemens in her 3D IC podcast.

Links to the half-hour podcast and video are in the comments. Here's a two-minute snippet:

07/09/2026

At ECTC: a 3-minute interview with Chuck Woychik, our VP of Business Development.

Chuck Woychik, VP of Business Development at NHanced Semiconductors Inc.

06/23/2026

Big news at NHanced! We are now part of QCi.

Quantum Computing completes acquisition of NHanced Semiconductors; strategic acquisition accelerates roadmap initiatives, expands manufacturing capabilities