NHanced Semiconductors, Inc.

05/12/2026

NHanced and U. of Florida will present at ECTC in Orlando

Woychik and Asadi’s team from U. of Florida will detail a new predictive reliability model for hybrid bonding

05/08/2026

Bob Patti will be a plenary speaker for the 29th Lithography Workshop in Sedona.
https://www.lithoworkshop.org/

05/01/2026

A new online magazine debuts today: "Global Advanced Packaging." Look who's featured! (Links to magazine are in first two comments below.)

04/21/2026

Our Odon facility has come a long way in 4.5 years!
Check out the news video from December 2021:

Hanced semiconductors is one of two firms setting up shop at WestGate Technology Park. WestGate sits on the west side of the Crane Navy base.

02/11/2026

NHanced chooses Avalanche’s space-grade MRAM for radiation-hardened FPGAs, targeting long-life satellite and defense applications where flash and ReRAM fall short.

02/03/2026

The next wave of advanced packaging won’t be defined by scaling alone. It’ll be defined by who can control heat and prevent a total meltdown.

https://www.semiconductorpackagingnews.com/articles/92010.html

02/03/2026

Everyone talked about hybrid bonding last year.

Hybrid bonding showed up in nearly every technical discussion across conferences, customer roadmap meetings, and design reviews. That didn’t happen by coincidence.

Read the blog: https://nhanced-semi.com/2025/12/17/hybrid-bonding-everywhere/

01/30/2026

ANNOUNCED: When failure isn’t an option, the right packaging and memory architecture become mission-critical. Especially in somewhere like space.

We’ve partnered with Avalanche Technology to deliver the industry’s first truly Space Grade MRAM boot solution for rad-hard SiP integration.

Details in the comments.

12/16/2025

Remember the Besi bonder we recently brought into our Morrisville, North Carolina fab?

It just went operational, making us the first advanced packaging foundry to deploy and run this top-of-the-line bonding platform.

New Besi advanced bonding system enters production, increasing yield and throughput

08/19/2025

Proud to support Pritzker School of Molecular Engineering at the University of Chicago in training the next generation of engineers who will design and build tomorrow’s chips right here in America.

UChicago-led NSF ACE-3D Chip Design Hub will focus on propelling domestic computer chip manufacturing efforts