NHanced Semiconductors, Inc.

08/20/2026

We’re excited to share that NHanced Semiconductors, a QCi Company, will be presenting at SMTA International 2026 alongside researchers from the University of Florida.

NHanced Vice President Dr. Charles Woychik and Dr. Navid Asadizanjani of the Florida Semiconductor Institute will present:

“Advanced Packaging for Photonics: Hybrid Bonding and Silicon Interposer Integration.”

As photonic systems continue to scale for high-bandwidth applications, including co-packaged optics and AI interconnects, advanced packaging is becoming increasingly critical. The presentation will explore how Cu-Cu hybrid bonding and high-density silicon interposers can enable 2.5D heterogeneous integration of chiplets, supporting higher-density, more energy-efficient photonic-electronic systems.

The team will also highlight key challenges in areas such as bonding defectivity, alignment accuracy, thermal management, and materials integration, as well as the opportunities these technologies create for next-generation photonic and AI infrastructure.

We look forward to sharing our work and connecting with others advancing the future of semiconductor packaging, photonics, and AI interconnects.

Fine-pitch Cu-Cu hybrid bonding and high-density silicon interposers enable 2.5D heterogeneous chiplet integration for silicon photonics

08/11/2026

A press release from our parent, QCi -- link in first comment

07/27/2026

In today's chips, most of the power and time are consumed by interconnect -- "wire" -- rather than by active silicon. In addition, most of the silicon area is consumed by components that are idle. Advanced packaging meaningfully addresses both of these problems.

Bob Patti discusses this with Tova Levy of Siemens in her 3D IC podcast.

Links to the half-hour podcast and video are in the comments. Here's a two-minute snippet:

07/09/2026

At ECTC: a 3-minute interview with Chuck Woychik, our VP of Business Development.

Chuck Woychik, VP of Business Development at NHanced Semiconductors Inc.

06/23/2026

Big news at NHanced! We are now part of QCi.

Quantum Computing completes acquisition of NHanced Semiconductors; strategic acquisition accelerates roadmap initiatives, expands manufacturing capabilities

06/19/2026

The Critical Role of Advanced Packaging: using next-generation i-line lithography, hybrid bonding, and heterogeneous integration to increase flexibility, reduce cost, and promote innovation

Using next-generation i-line lithography, hybrid bonding, and heterogeneous integration to increase flexibility, reduce cost, and promote innovation

06/11/2026

NHanced contributed an article to Electronics Weekly, exploring the shift from SoCs to chiplets and the role of advanced packaging:

The shift from monolithic system-on-chip (SoC) designs to chiplet-based architectures is not simply architectural; it raises the bar for advanced packaging.

06/10/2026

Presenting at the Symposium on Counterfeit Parts & Materials

Woychik and Asadi’s team from U. of Florida will detail a hardware-level security framework for detecting counterfeit parts and materials

05/12/2026

NHanced and U. of Florida will present at ECTC in Orlando

Woychik and Asadi’s team from U. of Florida will detail a new predictive reliability model for hybrid bonding

05/08/2026

Bob Patti will be a plenary speaker for the 29th Lithography Workshop in Sedona.
https://www.lithoworkshop.org/