S3IP - IEEC - 2011 Electronics Packaging Symposium

Among the most exciting developments are those in the micro and nanoscale area. Researchers working at or near the molecular level have recently made significant breakthroughs that will enable companies to create entirely new products, applications, and highly efficient manufacturing techniques. Applications for these technologies include: biomedical devices, diagnostic equipment, medical/surgical

applications, telecommunications, aerospace, optical data storage and transmission, military observation, detection and communications, and a wide range of commercial applications. Many of these applications require products to perform in harsh environments where they must withstand thermal stresses, vibration and shock. As a result, there has been a great deal of research and innovation concerning robust design and the selection of novel materials. Some of the most spectacular developments in electronics packaging are now beginning to take shape. The symposium will focus on providing the attendees with information about promising new technologies and developments that are now impacting the electronics industry. Participants will receive overviews and research reports on a range of emerging technologies including: National Trends, Thermal Management, 3-D Packaging, Sensors/MEMs, Power Electronics, Packaging for Harsh Environments, Interconnects, Miniaturization, and Flexible/Printed Electronics.