Indium Corporation

Indium Corporation Founded in 1934. From One Engineer To Another®

The Indium Corporation is a global engineered mate

SEMICON Taiwan 2026 is in full swing!As evolves to meet the demands of AI and high-performance computing, advanced pac...
09/03/2026

SEMICON Taiwan 2026 is in full swing!

As evolves to meet the demands of AI and high-performance computing, advanced packaging, thermal management, and system-level performance are becoming increasingly critical.

We are on the show floor addressing these exact challenges with our proven materials designed to help manufacturers enable the next generation of AI, from copper sintering and flux-free soldering to and no-clean flux solutions.

There’s still time to connect! Visit us at Booth I2416 to meet our experts and explore the technologies helping tackle the advanced packaging and thermal challenges of next-generation AI infrastructure.

09/02/2026

A new chapter for Indium Corporation in Mexico.

We were proud to celebrate the grand opening of our new facility in Guadalajara, Jalisco, a milestone that reflects our continued commitment to Mexico and strengthens our ability to support customers throughout the region.

The celebration brought together employees, customers, partners, and leadership to mark this achievement and recognize the people whose collaboration and hard work helped bring the Guadalajara facility to life.

A special thank you to our Mexico team and everyone who joined us in celebrating this milestone.

We’re proud to call Guadalajara our newest global home and look forward to all that we will accomplish together.

New to manufacturing? That's okay — we'll teach you. Many of our team members started with zero experience and built rea...
09/02/2026

New to manufacturing? That's okay — we'll teach you. Many of our team members started with zero experience and built real careers here. If you're reliable and ready to learn, we want to hear from you.

Apply today 👉:
https://hubs.la/Q04wfz4c0

Steady work, close to home. We're hiring Material Handlers and Shipping & Receiving staff across our Central New York fa...
08/31/2026

Steady work, close to home. We're hiring Material Handlers and Shipping & Receiving staff across our Central New York facilities — full-time, with training provided. No experience needed to get started.

Apply today 👉:
https://hubs.la/Q04vWn_f0

The next generation of AI demands more than powerful chips. From complex packaging architectures to increasing power con...
08/28/2026

The next generation of AI demands more than powerful chips. From complex packaging architectures to increasing power consumption and thermal demands, materials play a critical role in enabling AI performance.

Join our Senior Area Technical Manager, Jason Chou, at SEMICON Taiwan next week for his presentation on "Material Solutions for AI Industry from Packaging to System Assembly," where he will explore materials solutions designed to address key AI manufacturing challenges, including:

✅High-performance flux materials for micro-bump wafer bumping and Chip-on-Wafer (CoW) processes
✅Mid-temperature solder pastes designed to eliminate Head-in-Pillow (HiP) and Non-Wet-Open (NWO) defects
✅High-performance thermal interface materials (TIMs) designed to enhance the thermal efficiency of high-performance computing (HPC) chips

Don’t miss your chance to learn how our portfolio of next-gen technologies can help address critical challenges across the AI ecosystem, from advanced packaging to system assembly.

Speak with our team of technical experts at Booth I2416 at the show to learn more about how we are powering the AI revolution!

AI innovation doesn’t stop at the chip. It depends on the entire ecosystem and the materials that help make that system ...
08/28/2026

AI innovation doesn’t stop at the chip. It depends on the entire ecosystem and the materials that help make that system possible.

As high-performance computing (HPC) and AI rapidly advance, manufacturers are navigating increasingly complex packaging, higher power densities, tighter thermal requirements, and growing pressure to improve yield and accelerate time-to-market.

We’re addressing these challenges with proven technologies engineered for the realities of next-generation manufacturing at SEMICON Taiwan next week.

From flux and solder pastes for fine-pitch advanced packaging to high-performance solder thermal interface materials (sTIMs) for cooling the system, and sintering pastes and formic acid soldering technology (FAST) materials for powering the system forward, our full portfolio is designed to:

• Improve reliability as power densities increase
• Address warpage, voiding, and increasingly demanding thermal requirements
• Support efficient heat transfer in high-performance and liquid-cooled AI systems

Getting to the next generation of AI isn't only about what's possible. It's about making it reliable, manufacturable, and scalable. That’s where our materials and expertise can make the difference.

Visit our experts at Booth I2416 during the show to discover how we can solve your complex challenges, from advanced packaging to thermal management.

See you next week!

08/27/2026

Indium Corporation’s doors are officially open in Guadalajara, Mexico!

Building on decades of engagement in Mexico, the opening of our new Guadalajara facility represents an important next step in our longstanding commitment to the region.

Bringing this facility to life was a collaborative effort, with teams across Indium Corporation coming together to turn a shared vision into reality. The new operation strengthens our capabilities in the Americas and is an important addition to Indium Corporation’s global manufacturing network.

Thank you to everyone who helped make this milestone possible. We’re proud to begin this next chapter in Guadalajara!

There’s something special about getting together outside of the workday – especially when a little friendly competition ...
08/26/2026

There’s something special about getting together outside of the workday – especially when a little friendly competition is involved! 💚

Our Indium Corporation team in Malaysia came together for Sports Day 2026, filling the day with bowling, futsal, plenty of cheering, and even more smiles.

But the best part wasn’t the trophies. It was seeing colleagues come together, encourage one another, share some laughs, and enjoy being a team. Moments like these celebrate the connections that bring us together as One Indium, wherever we are around the world.

A big thank you to everyone who participated and to the team behind the scenes who put so much care into making the day a memorable one. Judging by these smiles, we’d say it was a day well spent! 🏆

Come Electrify the Future of with us this week at PCIM Asia 2026!⚡Join our experts August 26–28 in Shenzhen, China, wh...
08/25/2026

Come Electrify the Future of with us this week at PCIM Asia 2026!⚡

Join our experts August 26–28 in Shenzhen, China, where we’ll showcase our advanced materials solutions designed to enable high-reliability power device packaging and next-generation .

Featured technologies include:

• FAST (Formic Acid Soldering Technology): flux-free, high-reliability soldering for next-generation power device assembly

• InFORCE®29: pressure Cu sinter pastes for high reliability and thermal conductivity

• InFORCE®MF: proven pressure Ag sinter paste that delivers excellent shear strength and mechanical reliability

• InBAKE™29: pressureless Cu sinter paste for high-temperature, high-conductivity applications

Visit our team at Hall 16, Booth F30, to discover how our latest innovations are helping power electronics go further in performance, reliability, and efficiency.

We'll see you at the show!

Collaboration is key to advancing the next generation of high reliability .We were excited to join our partners at Hell...
08/21/2026

Collaboration is key to advancing the next generation of high reliability .

We were excited to join our partners at Heller Industries in Guadalajara, Mexico, for a seminar focused on formic acid reflow and its use for demanding applications where cleanliness, void reduction, and process control are critical.

Together, our technical experts explored how fluxless formic acid reflow can help manufacturers address challenges in advanced packaging, power electronics, wafer bumping, IGBT, and other high-reliability applications, including the potential to achieve less than 1% voiding when formic acid is combined with vacuum reflow.

Thank you to Heller Industries for hosting us at your Guadalajara Demo Lab and to everyone who joined the conversation. Partnerships like this enable us to bring materials and process expertise together, share knowledge with our customers, and help drive the future of !

To learn more about our next-gen Formic Acid Soldering Technology (FAST) suite of products, visit us at https://hubs.la/Q04tJ_190

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301 Woods Park Drive, Suite 301
Clinton, NY
13323

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(315) 853-4900

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