Indium Corporation

Indium Corporation Founded in 1934. From One Engineer To Another®

The Indium Corporation is a global engineered mate

The future of innovation is here – meet the first group of Indium Corporation's 2026 summer interns!Representing a varie...
05/29/2026

The future of innovation is here – meet the first group of Indium Corporation's 2026 summer interns!

Representing a variety of universities, disciplines, and backgrounds, these students will soon begin their summer experience with teams across our company.

Take a look at where they're studying, what they're pursuing, and the teams they'll be joining this summer.

Stay tuned for Part 2, where we'll introduce the rest of this year's intern class.

Liam Adams - SUNY Polytechnic Institute
Nicholas Bonfardeci - SUNY Polytechnic Institute
Leticia Cavadas - University of Notre Dame
Zachary Cullen - Clarkson University
Megan Fialkowski - St. Bonaventure University
Matthew King - Grove City College
Caroline Leary - Cornell University

Earlier this month, we attended Focus on PCB alongside our partner, CCI Eurolam Group, in Vicenza, Italy! It was a great...
05/28/2026

Earlier this month, we attended Focus on PCB alongside our partner, CCI Eurolam Group, in Vicenza, Italy! It was a great opportunity to showcase our next-generation solder technologies designed for high-reliability applications across , ranging from automotive to mobile.

During the conference, our Regional Technical Manager, Graham Wilson, highlighted how our Durafuse® technology addresses two critical challenges in electronics manufacturing: voiding and process-related warpage.

✔️ Durafuse®HR eliminates the traditional tradeoff between reliability and processability by delivering enhanced thermal cycling performance with excellent voiding control in standard reflow profiles.
✔️ Durafuse®LT provides a low-temperature drop-in solution that helps protect temperature-sensitive components while minimizing substrate and package warpage.

Great work, Graham, and thank you to everyone who stopped by to connect with us at the event!

To learn more about how we are leading the Next Revolution of Solder with our high-reliability materials, visit us at https://lnkd.in/gBkZKzrg

The future of relies on materials that can keep pace with increasing performance, thermal, and reliability demands.Our...
05/27/2026

The future of relies on materials that can keep pace with increasing performance, thermal, and reliability demands.

Our team is excited to showcase a full portfolio of high-reliability materials solutions designed to support the next wave of electrification and AI-driven innovation.

Visit us at PCIM June 9–11 at Hall 6, Booth 358 to explore featured technologies, including:

FAST (Formic Acid Soldering Technology): Flux-free soldering materials that deliver ultra-low voiding and high-reliability joints

InFORMS®: Reinforced solder preforms that enhance mechanical strength and bondline consistency

InFORCE®MF: Pressure silver sinter paste engineered for demanding SiC die-attach applications

InFORCE®29: Pressure copper sinter paste for high-reliability die-attach and substrate-attach applications

InBAKE™29: Pressureless copper sinter paste developed for high electrical and thermal conductivity

AuLTRA® Precision Die-Attach Preforms: Gold-based preforms built for critical, high-reliability power electronics packaging

Durafuse® HT: High-temperature, lead-free solder paste that is ideal for discrete power electronics devices

Ready to learn more? Come see us during the show at Hall 6, Booth 358, to connect with our experts and discover how we are Electrifying the Future of .

We'll see you in Nuremberg!

Join us at ECTC 2026 this week as we showcase the next generation of semiconductor packaging and assembly materials engi...
05/26/2026

Join us at ECTC 2026 this week as we showcase the next generation of semiconductor packaging and assembly materials engineered to solve today’s complex challenges. From breakthrough thermal performance to high-reliability assembly solutions, our latest innovations are built to enable the future of advanced electronics.

Visit Booth 240 to explore our newest technologies across three key material platforms, including:

✔️NC-809 no-clean flip-chip flux engineered to deliver strong wetting performance for ball-attach applications.

✔️InFORCE® series sintering pastes for superior thermal conductivity and reliable power discrete die-attach.

✔️Heat-Spring® thermal management solutions designed to maximize heat dissipation for power-dense devices exceeding 1,000 watts.

Our technical experts are ready to discuss how these advanced materials can elevate reliability, performance, and manufacturing efficiency in your next application.

We look forward to connecting with you in Orlando!

Learn more about our full lineup of featured products at: https://www.indium.com/applications/semiconductor-packaging-and-assembly/?utm_source=website&utm_medium=social&utm_campaign=ECTC2026&utm_term=PreShow

This Memorial Day, we pause to remember and honor the service members who gave their lives in service to the United Stat...
05/25/2026

This Memorial Day, we pause to remember and honor the service members who gave their lives in service to the United States.

As we reflect today, we recognize the importance of remembrance, service, and sacrifice – values that resonate across communities worldwide.

From all of us at Indium Corporation, thank you. We wish our employees, customers, partners, and communities a safe and meaningful Memorial Day.

“Find your favorite element. Find your Utica. Take some risks. Become the gift.”Those were some of the words shared by I...
05/21/2026

“Find your favorite element. Find your Utica. Take some risks. Become the gift.”

Those were some of the words shared by Indium Corporation President & CEO Ross Berntson during his Commencement address to the Mohawk Valley Community College Class of 2026.

Speaking to graduates, families, faculty, and community members, Ross reflected on the unexpected journey that brought him to the Mohawk Valley and to Indium Corporation - and how curiosity, persistence, and a willingness to keep learning can open doors you never imagined.

Those same values continue to shape our teams, customers, and partnerships around the world as we work together to solve challenges, advance technology, and create meaningful impact across industries and communities.

Congratulations to all MVCC graduates on this incredible achievement, and best wishes as you begin your next chapter!

📸 Photo credit: Observer-Dispatch & Mohawk Valley Community College

AI data centers and high-power electronics are growing at an incredible rate. This expansion requires new approaches to ...
05/18/2026

AI data centers and high-power electronics are growing at an incredible rate. This expansion requires new approaches to thermal management and system reliability. This week, our team will tackle these complex challenges at the Surface Mount Technology Association (SMTA) Electronics in Harsh Environments Conference!

Don't miss two key presentations from our experts, Karthik Vijay and Andreas Karch, as they share their latest research.

Karthik's presentation on Tuesday, May 19 at 11:30 a.m. CEST, will discuss advanced cooling technologies for AI data centers, including:
✅ Upgrading traditional air cooling to direct chip and immersion cooling systems
✅ Using solder-based Thermal Interface Materials (sTIMs) to improve Power Usage Efficiency (PUE)
✅ Boosting Application-Specific Integrated Circuit (ASIC) performance and lifespan without thermal breakdown

Andreas will explore the latest advancements in sintering technologies for power electronics on Thursday, May 21 at 11:15 a.m. CEST. His session will cover:
✅ Using silver sintering to keep connections stable at extreme temperatures
✅ Supporting the heavy demands of modern automotive power applications
✅ Developing essential International Electrotechnical Commission (IEC) industry standards for mass production

Connect with Karthik and Andreas during the conference to discover how these material breakthroughs can enable your success. We look forward to seeing you there!

AI and high-performance computing (HPC) applications continue pushing hardware to extreme temperatures. Indium-based sol...
05/13/2026

AI and high-performance computing (HPC) applications continue pushing hardware to extreme temperatures. Indium-based solder thermal interface materials (sTIMs) offer a proven path forward to keep these critical systems cool.

Don't miss Applications Development Engineer, Kyle Aserian, present his research on solving complex heat dissipation issues in advanced processors.

He will share in-depth insights into the distinct advantages of indium sTIMs, including:

🔷Delivering a high thermal conductivity of 86W/mK
🔷Enhancing metallurgical bond capability, thermal cycling performance, and long-term reliability
🔷Utilizing an innovative vacuum formic acid reflow process to minimize voiding
🔷Ensuring uniform heat dissipation for critical multi-reflow applications like BGA assembly

Come see us at Booth 240 during the show to meet our engineers and discuss your specific thermal management needs.

We'll see you in Orlando!

That's a wrap for SEMICON SEA 2026! Thank you to everyone who engaged with our team, attended our technical sessions, an...
05/11/2026

That's a wrap for SEMICON SEA 2026! Thank you to everyone who engaged with our team, attended our technical sessions, and visited our booth. We enjoyed highlighting our portfolio of high-reliability soldering and sintering technologies for Assembly.

The enthusiasm, collaboration, and insights from customers, colleagues, and partners made this year’s show a standout experience for us.

We hope to see everyone back in Malaysia for SEMICON SEA 2027!

To learn more about how we are driving reliability with our latest materials solutions, visit us at https://www.indium.com/applications/power-electronics-packaging-and-assembly/?utm_source=website&utm_medium=social&utm_campaign=SEMISEA2026&utm_term=PostShow

Last week we were proud to recognize National Apprenticeship Week, a nationwide celebration that highlights the impact o...
05/08/2026

Last week we were proud to recognize National Apprenticeship Week, a nationwide celebration that highlights the impact of apprenticeship programs in developing skilled talent, strengthening our workforce, and creating meaningful career pathways.

Apprenticeships combine hands-on experience with structured learning, allowing individuals to build their skills while contributing in real time. These programs play a vital role in supporting economic growth -especially in communities like ours.

As one of our many employee growth programs globally at , our apprenticeship programs continue to make a strong impact. Here's what we’ve accomplished so far:

✅10 cohorts
✅Over 75 apprentices and mentors combined
✅20 graduates with their journey worker cards, and more on the way soon!

Trades included: Industrial Manufacturing Technician, Electro-Mechanical Technician, Tool & Die, Quality Assurance, and Software Developer.

Join us in celebrating by recognizing an apprentice, learning more about our programs, and being part of the impact. Thank you to our apprentices & mentors for everything you do - you are a key part of our success!

Last month, two of our leading technical experts, Joe Hertline, Sr. Product Manager, & Ryan Mayberry, Sr. Application De...
05/07/2026

Last month, two of our leading technical experts, Joe Hertline, Sr. Product Manager, & Ryan Mayberry, Sr. Application Development Engineer, attended the Center for Power Electronics Systems, Virginia Tech (CPES) Annual Conference!

We had a great time connecting with students, industry leaders, researchers, and the entire community this year. At the booth, we shared how we are Electrifying the Future of with our die-attach, package-attach, thermal, and flux-free soldering solutions for enhanced reliability and efficiency.

Thank you to everyone who took the time to engage with our team!

To explore more of our next-generation technologies for , visit us at https://www.indium.com/applications/power-electronics-packaging-and-assembly/?utm_source=website&utm_medium=social&utm_campaign=CPES2026&utm_term=PostShow

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