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Indium Corporation Founded in 1934. From One Engineer To Another®

The Indium Corporation is a global engineered mate

For more than 90 years, Central New York has been home to Indium Corporation. While our reach has grown around the world...
10/14/2026

For more than 90 years, Central New York has been home to Indium Corporation. While our reach has grown around the world, our roots here remain strong, and we know firsthand the impact manufacturing has on the communities we call home.

That's why we were honored to serve as the presenting sponsor of the Manufacturers Association of Central New York (MACNY) Legislative Breakfast, where our President and CEO, Ross Berntson, joined a panel discussion on the future of manufacturing in New York.

These conversations matter because the decisions made today affect more than businesses. They affect the people who build their careers in manufacturing and the families and communities that depend on them.

Thank you to MACNY for bringing these important conversations forward!

Cheers to a successful IMAPS Symposium 2026 in Boston last week!We had a great time connecting with the community and ...
10/12/2026

Cheers to a successful IMAPS Symposium 2026 in Boston last week!

We had a great time connecting with the community and showcasing our advanced materials solutions supporting the AI revolution and the next generation of , from high-performance thermal interface materials (TIMs) to copper sintering technology and flip-chip fluxes.

During the conference, three of our leading experts, Sze Pei Lim, Dr. Hongwen Zhang, and Jason Chou shared their technical expertise through presentations highlighting our portfolio of innovations designed to address complex and involving industry challenges for critical applications like advanced packaging, heterogeneous integration, AI, high-performance computing (HPC), and lower-temperature soldering.

Thank you to everyone who stopped by our booth to connect with our team, attended our sessions, and explored how we are enabling the entire AI ecosystem with our portfolio of next-generation materials.

We hope to see you in San Diego for the IMAPS 2027!

What if optimizing solder materials and reflow technology could reduce energy consumption by 25%?That was the focus of a...
10/09/2026

What if optimizing solder materials and reflow technology could reduce energy consumption by 25%?

That was the focus of a joint presentation by Indium Corporation and SMT Thermal Discoveries at EFX – Expo for Electronics Manufacturing in Germany.

During their session, “Energy Efficiency in the Soldering Process,” Indium Corporation’s Technical Manager – Technologist – Advanced Applications, Andreas Karch, and SMT Thermal Discoveries’ Sales Director Europe & Key Account Manager, Daniel Hamann, explored how combining innovative solder materials with advanced reflow technology can improve energy efficiency in electronics manufacturing.

The presentation highlighted two complementary technologies:

• Indium Corporation’s Durafuse® LT: A high-reliability mixed-alloy solder system designed to reflow at peak temperatures of approximately 200–210°C, significantly lower than the 240–250°C typically required for SAC305.

• SMT Thermal Discoveries’ Energy Saver R-Series: A convection reflow oven engineered to optimize heat transfer and reduce energy consumption through innovations in fan frequency, catalyst-pyrolysis technology, and process gas management.

The results? Testing demonstrated that combining Durafuse® LT with the Energy Saver R-Series achieved a 25% reduction in power consumption, annual energy costs, and CO₂ emissions compared with SAC305 processed in a standard reflow oven.

Thank you to everyone who visited our booth, attended the session, and joined the conversation about advancing energy efficiency in electronics manufacturing!

That's a wrap for SMTA Guadalajara 2026!What an incredible week it’s been connecting with industry peers, supporting cus...
10/09/2026

That's a wrap for SMTA Guadalajara 2026!

What an incredible week it’s been connecting with industry peers, supporting customers, exchanging ideas, and highlighting our high-reliability solder materials, from our next-gen Durafuse® technology to low-silver alloys and robotic soldering wire.

We’re truly grateful to everyone who visited our booth and took the time to engage with our team during the show. The energy, collaboration, and insights from the community helped make this year’s show a standout experience for us.

Thank you for making one to remember. We can’t wait to reconnect in Guadalajara next year!

To learn more about how our solutions can enable your complex assemblies, visit us at:
https://hubs.la/Q04zKDgj0

Celebrating Andreas Karch and the IEC 1906 AwardA proud moment for Indium Corporation as we celebrate Andreas Karch rece...
10/07/2026

Celebrating Andreas Karch and the IEC 1906 Award

A proud moment for Indium Corporation as we celebrate Andreas Karch receiving the prestigious IEC 1906 Award in recognition of his outstanding contribution to the development of international standards for electrical and electronic technologies.

Presented on 16th September in Offenbach, Germany, the award recognises exceptional individual achievements that contribute to making products and electrical systems safer, more efficient and more reliable.

Andreas’ recognition reflects his leadership within the International Electrotechnical Commission (IEC), where he serves as Chairman of the committee responsible for sintering technology.

As sintering becomes increasingly important in advanced power electronics and next-generation semiconductor applications, robust international standards are essential to ensuring reliable, consistent and high-performance processes. Through his work with the IEC, Andreas is helping bring together industry expertise to establish the technical framework needed to support this rapidly developing technology.

Reflecting on receiving the award, Andreas said “I am delighted to have received the ‘IEC 1906 Award’. I would like to pass this award on to the entire ‘Sintering’ working group of the DKE”.

This achievement also highlights Indium Corporation’s commitment to innovation, technical leadership and the development of advanced materials and solutions for power electronics.

Congratulations, Andreas, on this well-deserved international recognition!

High reliability. Lower temperatures. Finer features. What’s your biggest electronics assembly challenge?For high-reliab...
10/02/2026

High reliability. Lower temperatures. Finer features. What’s your biggest electronics assembly challenge?

For high-reliability applications like automotive, manufacturers need solder materials that can perform under demanding conditions while addressing challenges such as thermal cycling, voiding, warpage, and increasingly complex assemblies.

At EFX 2026, our team will showcase next-gen solder technologies designed to solve these complex challenges:

✅Durafuse® HR: Combines enhanced thermal cycling performance with superior voiding control, while helping reduce solder joint cracking and increase shear strength.
✅Durafuse® LT: Enables low-temperature step soldering and sustainable energy savings while addressing challenging assemblies with broad temperature gradients and large BGAs with complex warpage profiles.
✅Indium12.9HF: This new no-clean, halogen-free solder paste is formulated for fine-feature printing down to 01005 and 008004 components, delivering high stencil print transfer efficiency, low voiding, and strong oxidation resistance.

Whether you’re working to improve thermal cycling reliability, control voiding, manage BGA warpage, lower reflow temperatures, or achieve consistent fine-feature printing in your manufacturing processes, come connect with our technical experts about your applications.

Experience the Next Revolution of Solder with us at Booth 9A79.

We'll see you in Stuttgart!

Thank you for joining us at PCB West 2026 earlier this week in Santa Clara, California!Our team had a great time connect...
10/02/2026

Thank you for joining us at PCB West 2026 earlier this week in Santa Clara, California!

Our team had a great time connecting with attendees, sharing technical insights, and highlighting our next-gen solder materials, including our portfolio of FAST (Formic Acid Soldering Technologies) and Durafuse® technology for critical applications like and automotive.

During the conference, our Sr. Applications Development Engineer, Ryan Mayberry delivered a session on "Advanced Reflow Technology: Formic Acid Soldering," where he examined the advantages and limitations of formic acid reflow compared with traditional soldering methods, including how combined with vacuum can enable a true no-clean process, achieve ultra-low voiding, and reduce environmental impact by eliminating cleaning and associated waste.

Great work, Ryan!

To learn more about how FAST suite is advancing reflow technology for today’s electronics assembly challenges, visit us at https://hubs.la/Q04z0Qg10

Thank you to DELSYS for hosting a great customer event at the Verkehrshaus Luzern, and to everyone who joined us for a d...
10/01/2026

Thank you to DELSYS for hosting a great customer event at the Verkehrshaus Luzern, and to everyone who joined us for a day of technical discussion, industry insights and networking!

Andreas Karch, Technical Manager – Technologist – Advanced Applications presented: “Alloy Technology for Solder Pastes with Reduced Silver Content and for High Reliability”

With this year’s event focused on “High Mix – Low Volume,” the discussions highlighted the need for electronics manufacturers to continually balance quality, productivity, cost, reliability and environmental performance.

Alloy selection plays an important role in that equation. Developments in solder paste technology can provide manufacturers with opportunities to optimise material performance while addressing the demands of increasingly complex and diverse production environments.

It was great to exchange ideas with customers, partners and fellow industry experts and to discuss the challenges facing electronics manufacturing in Switzerland and beyond.

A special thank you to DELSYS for bringing the industry together, and for choosing such an exceptional venue.

We look forward to continuing the conversation!

Are you attending the IMAPS Symposium this week? Don't miss three of our leading technical experts, Sze Pei Lim, Jason C...
09/29/2026

Are you attending the IMAPS Symposium this week? Don't miss three of our leading technical experts, Sze Pei Lim, Jason Chou, and Hongwen Zhang, Ph.D., share new research and materials solutions for advanced packaging, AI, and HPC applications.

🔹Novel Interconnect Materials for Advanced Packaging Assembly Processes

Join Sze Pei as she explores innovative materials for heterogeneous integration and high-density packaging, including ultra-low-residue fluxes, an adhesive agent for fluxless soldering, and solder paste technologies for ultra-fine-pitch printing, with applications spanning SiP, TCB, LAB, and 2.5D packaging.

🔹Material Solutions for AI/HPC Packaging from Wafer Bumping to System Assembly

Jason will discuss specialized materials designed to address solder joint integrity, thermal management, and other AI & HPC packaging challenges, from ultra-low residue fluxes and mid-temperature solder pastes to advanced (TIMs).

🔹A Bi-free, In-containing, Lower-temperature Solder Applicable in Large BGA Assembly for HPC

Learn about Durafuse® LT, a Bi-free, indium-containing, lower-temperature solder alloy designed for hierarchical assembly, including how its 210°C peak reflow capability can help mitigate warpage-related defects in large BGA assemblies while supporting mechanical and electrical reliability.

We look forward to connecting with the community and exchanging ideas about what’s next for advanced packaging applications. Visit our team at Booth 535 to continue the conversation!

09/29/2026

Most internships come with a job description. This one starts with your idea. 💡

Indium Corporation’s Create Your Dream Internship is back for 2027, giving students the chance to pitch an internship based on their interests and career goals.

Whether your interests are in Marketing, R&D, Engineering, HR, or beyond, tell us what you want to explore, the skills you want to develop, and what your ideal internship could look like.

📅 Internship dates: May 31 – August 6, 2027

📍 Location: New York, with site varying by position

🎓 Eligibility: Undergraduate and graduate students enrolled in Fall 2027

Have an idea? We want to hear it.

💡 Submit your proposal: Create Your Dream Internship 2027 https://hubs.la/Q04yyYhc0

🔗 Learn more about Indium Corporation’s Internship Program: https://hubs.la/Q04yyYdM0

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301 Woods Park Drive, Suite 301
Clinton, NY
13323

Telephone

(315) 853-4900

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