What are the opening hours?

Monday 8am - 5pm Tuesday 8am - 5pm Wednesday 8am - 5pm Thursday 8am - 5pm Friday 8am - 5pm

Golden Altos

Name: Golden Altos
Address: 44061 Old Warm Springs Boulevard, Fremont, CA, 94538, US
Telephone: (408) 956-1010
Price range: $

Serving the semiconductor, military and aerospace industries since 1984.

09/01/2026

What do ISO 9001 and QML certification actually mean for your program?

ISO 9001 establishes a documented, audited quality management system covering everything from process control to corrective action, giving customers confidence that our operations are consistent and repeatable.

QML (Qualified Manufacturers List) status, awarded under MIL-PRF-38535, means Golden Altos has demonstrated the process controls and reliability data required to manufacture and qualify microcircuits for military and aerospace use.

Together, these certifications are the foundation of the quality system behind every device we assemble and test.

Learn more about our certifications: https://goldenaltos.com/us-based-hermetic-assembly/?utm_source=facebook

08/07/2026

Gold wire on aluminum bond pads is a common wire-bonding combination, but prolonged exposure to elevated temperatures can create reliability concerns at the interface.

Over time, gold and aluminum can react to form intermetallic compounds, including the brittle, purple-colored AuAl₂ commonly known as “purple plague.”

The concern is not always visible during initial inspection. A bond may pass electrical and mechanical testing after assembly, then degrade during extended thermal exposure or repeated temperature cycling.

At Golden Altos, we evaluate bond-pad metallization, wire compatibility, and sealing methods to catch these risks before assembly begins, because long-term reliability begins with selecting the right materials.

07/31/2026

How is the right sealing method selected for a semiconductor device?

The appropriate sealing method depends on several factors, including package construction, material compatibility, operating environment, hermeticity requirements, temperature limits, and the device’s intended service life.

Methods such as seam sealing, projection welding, solder sealing, glass-frit sealing, and epoxy sealing each offer different levels of environmental and mechanical protection. Selecting the right process helps protect the die, wire bonds, and internal circuitry while meeting the application’s performance and reliability requirements.

Discover more semiconductor packaging insights in our FAQ:
https://goldenaltos.com/faq/

07/17/2026

Reliability doesn't start at deployment. It's built into every step of the process.

For aerospace and defense semiconductor programs, that means controlled assembly processes, material traceability, supply chain visibility, and trusted manufacturing partners, from the very beginning.

As programs place greater emphasis on domestic capability and supply chain security, U.S.-based semiconductor packaging and test support play an increasingly critical role in reducing risk.

At Golden Altos, we support these requirements with U.S.-based semiconductor assembly, packaging, and test services, providing the process visibility needed for demanding aerospace and defense applications, where every process step matters.

Learn more about our aerospace and defense semiconductor assembly and test support: https://goldenaltos.com/us-based-hermetic-assembly/

07/10/2026

Loose particles inside a hermetic device can cause intermittent shorts, electrical interference, and other performance issues. Particle Impact Noise Detection (PIND) testing is used to screen hermetic devices for internal particulate contamination before it can impact device performance.

At Golden Altos, we perform PIND testing in-house across a wide range of hermetic package types as part of our screening and qualification services.

Learn more about our hermetic assembly and testing capabilities:
https://goldenaltos.com/us-based-hermetic-assembly/

07/03/2026

Happy Independence Day! 🇺🇸

Today, we celebrate the values of freedom, courage, and unity that continue to inspire generations.

As we gather with family, friends, and communities, we honor those who helped shape our nation's history and the countless individuals who contribute to its future every day.

Wishing everyone a safe, joyful, and meaningful Fourth of July.

06/26/2026

What factors determine whether a semiconductor device is assembled using Gold Ball Bonding or Aluminum Wedge Bonding?

Both processes create the electrical interconnections between the semiconductor die and package, but factors such as bond pad metallurgy, package design, wire diameter, and reliability requirements can influence which method is selected.

In this month's FAQ, we take a closer look at these two widely used wire bonding technologies and their role in semiconductor packaging.

https://goldenaltos.com/faq/

06/19/2026

MIL-STD-883 is one of the most widely used standards for testing and screening microelectronic devices in military, aerospace, and high reliability applications.

The standard includes a broad range of environmental, mechanical, and electrical test methods, as well as screening and qualification procedures used to assess device performance and reliability in demanding operating environments.

At Golden Altos, we support MIL-STD-883 programs through onshore hermetic assembly, testing, and qualification services as a DLA-approved supplier.

Questions about MIL-STD-883? Send us a message. We're happy to help.
https://goldenaltos.com/us-based-hermetic-assembly/

06/05/2026

Need to ensure ICs withstand extreme G-forces?

High-reliability components must withstand intense forces experienced during launch, vibration, and rapid motion. Constant Acceleration Testing screens for mechanical integrity under these conditions, ensuring devices perform when it matters most.

Performed in accordance with MIL-STD-883 Method 2001 and MIL-STD-750 Method 2006, this test helps validate structural strength and reliability for mission-critical applications.

Learn more: https://bit.ly/goldenaltos

06/03/2026

Golden Altos had the privilege of attending the Hire for Semiconductor & Manufacturing Event hosted by Ohlone College, and we left inspired.

We met with graduates from the Semiconductor Skills Bridge Academy (SSBA) and learned more about the skills they developed through hands-on training in Smart Manufacturing, Electronics, and Robotics.

Programs like SSBA play an important role in helping students prepare for careers in semiconductor and advanced manufacturing. It was great to see the enthusiasm and dedication of students preparing to begin their careers.

A huge congratulations to the SSBA graduates, and thank you to Ohlone College for creating this bridge between education and industry.

Address

44061 Old Warm Springs Boulevard
Fremont, CA
94538

Opening Hours

Monday	8am - 5pm
Tuesday	8am - 5pm
Wednesday	8am - 5pm
Thursday	8am - 5pm
Friday	8am - 5pm

Telephone

(408) 956-1010

Website

http://www.goldenaltos.com/

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