Polymer Science, Inc.

Name: Polymer Science, Inc.
Address: 2577 S Freeman Road, Monticello, IN, 47960, US
Telephone: (574)5833751

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Polymer Science, Inc.

Manufacturer of adhesive and coated products for medical, electronic and automotive industry Polymer Science, Inc.

delivers smart, agile and customer focused solutions for adhesives, tapes and coatings.

05/29/2026

After more than 45 years of innovation, leadership, and dedication across the automotive, energy conversion, consumer electronics, and advanced materials industries, we are proud to recognize the retirement of Kris Hanson.

During his five years at Polymer Science, Kris played an important role in supporting our customers and advancing solutions in thermal management and EMI shielding technologies. His technical expertise, industry knowledge, and commitment to customer success have left a lasting impact on our team and the many people who have had the opportunity to work alongside him.

Kris’s career has spanned multiple industries, companies, and leadership roles, reflecting a lifetime devoted to solving complex challenges and helping bring innovative technologies to market.

On behalf of everyone at Polymer Science, we thank Kris for his contributions, professionalism, and friendship. We wish him and his family all the best as he begins this well-earned next chapter.

Congratulations on your retirement, Kris, and thank you for an outstanding career.

05/25/2026

Today, we remember those who served—and those who gave everything.
⸻
Memorial Day is a time to pause.

To reflect on the sacrifice made by the men and women who served in defense of something larger than themselves.

Their commitment, discipline, and resilience are not abstract ideas—they are real, lasting contributions that continue to shape the world we live in today.

At Polymer Science, we recognize that the work we do—supporting critical applications across medical, electronics, and industrial systems—exists within a broader context made possible by that sacrifice.

Precision matters. Reliability matters.
And the ability to build, innovate, and operate freely is not something to take for granted.

Today, we honor those who made that possible.

05/14/2026

EMI shielding is no longer solved at the enclosure level.
It is now a distributed design problem across the device architecture.

Current system constraints are driving the shift:

– Miniaturization → reduced z-height eliminates traditional metal cans
– Higher frequencies (5G / high-speed data) → tighter grounding and leakage control
– Power density increases → EMI and thermal paths must be co-managed
– Complex assemblies → multiple interfaces, seams, and grounding points

The result:
Shielding effectiveness is increasingly determined by interfaces, not bulk material.

P-SHIELD® solutions are designed for integration into these architectures:

– Conductive tapes for grounding continuity across seams
– Fabric-over-foam systems for compression-based interfaces
– Conductive films and foils for low-profile shielding layers
– Adhesive systems engineered for reliable electrical contact under compression

The objective is not maximum dB attenuation in isolation.

It is consistent EMI performance across the full device assembly.

Explore P-SHIELD® EMI shielding solutions:
https://hubs.ly/Q04fdfJk0

05/12/2026

Adhesive performance on skin isn’t defined by a single data point—it evolves over time.

One of the most overlooked variables? Coat weight.

Too thin:
• Limited adhesive reservoir
• Faster moisture saturation
• Early edge lift and adhesion loss

Too thick:
• Increased occlusion
• Risk of overhydration
• Potential for skin irritation

Optimized coat weight:
• Balanced moisture v***r transmission (MVTR)
• Stable modulus over time
• Consistent adhesion across the full wear cycle

The goal isn’t maximum adhesion.
It’s predictable, stable adhesion in real-world conditions.

P-DERM® adhesive systems are engineered by tuning coat weight alongside MVTR and viscoelastic balance—so performance holds from application through removal.

⸻

Call to Action

Design for the full wear cycle—not just initial adhesion.

Explore P-DERM® solutions:
https://hubs.ly/Q04fdbWt0

Connect with our team:
[email protected]

05/07/2026

Thermal performance is not just about conductivity—it’s about selecting the right mechanism for your design.

Gap Fillers — Improve Contact
Used when surfaces are uneven or tolerances vary.
They compress to fill air gaps, increasing surface contact and improving heat transfer through the interface.
Best for:
• Irregular surfaces
• Variable gap thicknesses
• Low compression force assemblies

Heat Spreaders — Reduce Hot Spots
Used when heat needs to be redistributed.
They move heat laterally across the surface, reducing peak temperatures and improving uniformity.
Best for:
• High power density components
• Localized heat sources
• Large surface areas

Key Takeaway
Gap fillers move heat through.
Heat spreaders move heat across.
Many high-performance designs require both.

P-THERM® thermal interface materials are engineered to optimize thermal pathways, improve reliability, and support demanding applications across electronics, automotive, and industrial systems.

Find the right thermal solution for your design:
https://hubs.ly/Q04fd4Nd0

Or connect directly with our team:
[email protected]

05/04/2026

May the 4th be with your performance.

Uncontrolled EMI is not background noise—it’s a system risk.

P-SHIELD® PS-3217 is engineered to deliver consistent, multi-axis conductivity and reliable shielding in real-world conditions. Built with nickel-plated conductive foam and integrated mesh, it maintains electrical continuity while compressing easily into tight assemblies.

What this means for your design:
• Stable grounding across interfaces
• Reduced signal disruption
• Reliable performance under heat and humidity
• Compliance-ready material selection

When shielding performance matters, variability is not acceptable.

Call to Action
Take control of EMI before it controls your design.
Explore the full P-SHIELD® portfolio:
https://hubs.ly/Q04fc9yK0

04/28/2026

Skin adhesion in wearable devices is a time-dependent materials problem, not a single-point performance metric.

Initial peel and tack do not predict in-use performance because the system evolves under:
– Moisture ingress (sweat → plasticization, modulus drop)
– Thermal cycling (skin ~32 °C → environment)
– Mechanical strain (shear + peel under motion)
– Skin surface variability (sebum, hydration, roughness)

Failure modes are typically:
– Cohesive softening → edge lift propagation
– Interfacial failure under hydrated conditions
– MVTR mismatch → skin overhydration and adhesion loss

P-DERM® adhesive systems are engineered to control:
– Viscoelastic balance (tack vs cohesive strength)
– Moisture v***r transmission (MVTR tuning by construction)
– Long-term modulus stability under elevated humidity
– Clean removal without stratum corneum disruption

The design objective is not maximum adhesion.
It is stable adhesion over the full wear cycle.

04/27/2026

Polymer Science congratulates the Maverick Robotics Team from McCutcheon High School in Lafayette, Indiana on their historic State Championship win.

We are proud to support programs that develop applied engineering skills, problem solving discipline, and real-world technical ex*****on. This team’s performance reflects the value of hands-on STEM education and disciplined iteration under pressure.

As the Mavericks advance to the FIRST Championship in Houston, we recognize the effort behind the result—design, build, test, refine—and the leadership required to execute at that level.

Polymer Science remains committed to supporting the next generation of engineers, scientists, and technical leaders.

We wish the team continued success on the national stage.

04/17/2026

Join us at PSTC Tape Week 2026 in Louisville.

Polymer Science will be participating in a panel discussion on Medical Device Adhesive Trends, alongside Vybond and Henkel Adhesives, bringing a cross-industry perspective on where adhesive technology is headed in healthcare applications.

This session will focus on:
– Evolving requirements in skin-contact and wearable adhesives
– Performance vs. manufacturability tradeoffs
– Material innovation driving next-generation medical devices

May 7, 2026 | Louisville, KY

If you're working in medical devices, wearables, or advanced adhesive systems, this is a discussion worth attending.

Register here: https://hubs.ly/Q04czzKy0

03/23/2026

Thermal Conductivity vs. Heat Capacity — Why “k” Alone Isn’t Enough

Material selection for thermal management is often reduced to a single metric: thermal conductivity.

That approach misses how systems actually behave.

Key distinction:
• Thermal conductivity (k) → how fast heat moves
• Heat capacity (c) → how much energy is absorbed before temperature rises

These combine into thermal diffusivity:
Thermal diffusivity (α) = Thermal Conductivity (k) / (density (ρ) × heat capacity (c))

What this means in practice:
• Same k, different c → very different temperature response
• Lower c → faster temperature rise, higher hotspot risk
• Higher c → improved thermal buffering under transient loads

Where this matters:
• Wearable devices → skin temperature and comfort
• Electronics → hotspot formation and cycling reliability
• EV systems → transient thermal spikes vs steady-state load

Design takeaway:
Evaluate both:
• k for steady-state heat transfer
• ρc for real-world temperature response

If you’re only optimizing conductivity, you’re under-modeling the system.

Explore how Polymer Science optimizes thermal performance:
https://hubs.ly/Q047RwF60
[email protected]

Address

2577 S Freeman Road
Monticello, IN
47960

Telephone

(574)5833751

Website

http://www.polymerscience.com/

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