Teradyne Inc

Teradyne Inc Creating the next generation of technology through advanced test solutions and collaborative robotics

Last week, Teradyne's Matt Knowles joined the Samsung Semiconductor SAFE Forum to share insights on the evolving test ch...
06/05/2026

Last week, Teradyne's Matt Knowles joined the Samsung Semiconductor SAFE Forum to share insights on the evolving test challenges for AI-HPC and advanced heterogeneous integration. Thank you to everyone who attended the session and contributed to the great conversations.

A big thank you to everyone who attended our sessions at IEEE European Test Symposium 2026. It was a pleasure sharing ou...
06/04/2026

A big thank you to everyone who attended our sessions at IEEE European Test Symposium 2026. It was a pleasure sharing our latest work with such an engaged community of researchers, partners, and customers.

06/03/2026

Heading to SWTest? Don't miss our Teradyne experts taking the stage!

🔹 Join Monica Davis and representatives from Technoprobe and Marvell Technology for a deep dive on scaling silicon photonics test for high-volume production.

🔹 Chris Buckholtz presents a joint paper with NXP Semiconductors exploring the impact of interface design on wafer probe performance.

👉 Add their sessions to your SWTest agenda

Testing AI accelerators is becoming more complex as multi-die assemblies raise the risk of failure, making DFT innovatio...
06/02/2026

Testing AI accelerators is becoming more complex as multi-die assemblies raise the risk of failure, making DFT innovation significant for higher yield and greater reliability. In Semiconductor Engineering, Teradyne’s Jeorge Hurtarte explains how embedding DFT intelligence in silicon interposers secures TSV integrity, strengthens signals, and reduces noise across every die.

Read the full article to learn more: https://bit.ly/4x1KsiS

A single defective HBM stack can compromise an entire GPU package at final assembly, making earlier and more frequent te...
05/28/2026

A single defective HBM stack can compromise an entire GPU package at final assembly, making earlier and more frequent testing essential. In Semiconductor Engineering, Teradyne's Hanh Lai explains how integrators are driving demand for optimized test flows and how shift-left strategies are evolving for HBM4 and beyond.

đź”—Read the full article to learn more: https://hubs.li/Q04j3Gwh0

Join us at SWTest, where the semiconductor test community comes together to advance probe and test innovation. Discover ...
05/27/2026

Join us at SWTest, where the semiconductor test community comes together to advance probe and test innovation. Discover how we collaborate across the test cell ecosystem to deliver scalable, high volume test solutions for the industry’s newest technologies.

Visit us at Booth #513 to learn more

We're so proud to share that we have been named a Recognized Employer in the 2026 VETS Indexes Employer Awards. VETS Ind...
05/26/2026

We're so proud to share that we have been named a Recognized Employer in the 2026 VETS Indexes Employer Awards.

VETS Indexes honors organizations that demonstrate strong commitment to recruiting, hiring, retaining, developing, and supporting veterans and the broader military‑connected community.

"Veterans bring a unique combination of technical skill, accelerated learning, and principled leadership that strengthens our talent pipeline,” said Garrett Boesch, Global Supply Base Manager and Chair of Teradyne’s Veterans Employee Resource Group. “At Teradyne, we see firsthand how military experience translates into long-term career growth across engineering, manufacturing, and commercial roles. This continued recognition from VETS Indexes reflects our commitment to investing in veterans as a critical part of our workforce and culture.”

đź”— Read the full press release here: https://hubs.li/Q04hT8xH0

🇪🇺 Join us at ETS 2026 - European Test Symposium Meet Teradyne experts at where they will share their insights on powe...
05/25/2026

🇪🇺 Join us at ETS 2026 - European Test Symposium

Meet Teradyne experts at where they will share their insights on power test strategies for today’s increasingly complex semiconductor devices!

Smart test depends on a strong data chain with full visibility to catch latent defects. In Semiconductor Engineering, Te...
05/19/2026

Smart test depends on a strong data chain with full visibility to catch latent defects. In Semiconductor Engineering, Teradyn'es Eli Roth and Damian Megna highlight that real time, data driven control must be balanced with the right sensitivity to protect performance, equipment health, and overall results.

Read the full article: https://bit.ly/4uX4Z6t

HBM is redefining device test requirements as the focus shifts to optimizing data movement, requiring power, signal inte...
05/18/2026

HBM is redefining device test requirements as the focus shifts to optimizing data movement, requiring power, signal integrity, and package interactions to be validated together. In Electronic Design, Teradyne’s Hanh Lai and Honghui Chen explain how Teradyne is helping customers address the growing complexity of HBM testing as memory architectures advance in AI systems.

Read the full article: https://bit.ly/4nEIWz4

Address

600 Riverpark Drive
North Reading, MA
01864

Opening Hours

Monday 8am - 6pm
Tuesday 8am - 5pm
Wednesday 8am - 6pm
Thursday 8am - 6pm
Friday 9am - 6pm

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+19783702700

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