Advanced Thermal Solutions, Inc.

Advanced Thermal Solutions, Inc. Advanced Thermal Solutions, Inc. Since 1989.

designs and manufactures high-performance thermal management solutions for the electronics industry, supporting air, liquid, and refrigeration-based cooling across diverse applications worldwide.

06/11/2026

AMD Kria™ SOMs are built for edge AI, machine vision, robotics, and embedded computing — but reliable performance starts with proper thermal design.

ATS offers device-specific heat sinks designed for AMD Kria™ K24 and K26 System-on-Modules.

Key features include:
• Designed to fit AMD Kria™ SOM platforms
• Passive and active cooling options
• Straight-fin, black anodized aluminum construction
• Secure screw mounting
• Pre-assembled thermal interface material
• Fan attachment hardware kit provided for active heat sinks

Applications include:
• Robotics
• Machine vision
• Smart cameras
• Security systems
• Retail analytics
• Industrial communication and control

Learn more: https://f.mtr.cool/wqbcezhxtw

Thermal management is critical in medical equipment design, where reliability, safety, compact packaging, and long-term ...
06/11/2026

Thermal management is critical in medical equipment design, where reliability, safety, compact packaging, and long-term performance are essential.
📽️Watch Video: https://f.mtr.cool/rncjlfzyag

ATS reviews key thermal management challenges faced by engineers developing medical electronics and healthcare equipment. Topics include heat dissipation, airflow, component reliability, enclosure-level cooling, thermal testing, and design considerations for sensitive electronic systems.

This webinar is useful for engineers, product designers, and technical teams working with medical devices, embedded electronics, diagnostic systems, imaging equipment, power electronics, and compact electronic assemblies.

ATS supports engineers with thermal design consulting, simulation, testing, instrumentation, and advanced Thermal Characterization Labs for electronics cooling applications.

Questions? Email: [email protected]

Excess heat is no longer a secondary design issue — it directly impacts electronic reliability, performance, lifespan, &...
06/10/2026

Excess heat is no longer a secondary design issue — it directly impacts electronic reliability, performance, lifespan, & even warranty risk. Our latest newsletter “The Importance of Thermal Management” is relevant for engineers because it shows how early thermal analysis, CFD, testing, & system-level design choices can prevent costly redesigns & improve product confidence.
📰Thermal Management Today Newsletter: https://f.mtr.cool/gordzugwcr

• Learn practical thermal design lessons from real applications, including sealed enclosures, EV battery cooling loops, ruggedized rack systems, & passive aluminum enclosures.

• See why engaging thermal specialists early helps engineers reduce risk, optimize cooling performance, & deliver the right solution the first time.

Do you need thermal engineering expertise? https://f.mtr.cool/rjyzldwygg

AI processors, GPUs, and HPC systems need compact, scalable liquid cooling that can keep up with rising heat loads.ATS A...
06/10/2026

AI processors, GPUs, and HPC systems need compact, scalable liquid cooling that can keep up with rising heat loads.

ATS ArctiQ™ AI Cold Plates are engineered for next-generation high-density compute applications, with two precision liquid cooling series:

• NEXA Series Cold Plates
• High-efficiency liquid cooling for AI processors and GPUs
• Compact, lightweight aluminum construction
• Thermal resistance as low as 0.0056 °C/W
• Universal barb fittings for 8 mm OD / 5 mm ID tubing

• NIVIS Series Cold Plates
• Up to 6.5 kW of cooling for AI and HPC processors
• Socket-specific design for AMD SP5 architecture
• Aluminum and copper base options
• CFD-validated for demanding, high-power operation

From edge AI to data center systems, ArctiQ cold plates help engineers manage heat with precision, reliability, and scalable liquid cooling performance.

Learn more: https://f.mtr.cool/pxhelbnulb

The ATS CDU-RM250 Rack-Mount Coolant Distribution Unit packs serious liquid cooling performance into a compact 4U form f...
06/10/2026

The ATS CDU-RM250 Rack-Mount Coolant Distribution Unit packs serious liquid cooling performance into a compact 4U form factor for rack-level and modular data center applications.

Our web page features a new tool that lets engineers look inside the CDU-RM250 and explore the components that make it work, including the liquid-to-liquid heat exchanger, pumps, controls, fluid connections, and monitoring features.

Built for high-density electronics cooling, the CDU-RM250 delivers up to 235 kW of single-phase liquid cooling with intelligent PLC/HMI control, redundant pumps and power supplies, and a rack-friendly footprint.

Take a look inside:
https://f.mtr.cool/qctfqthmui

06/09/2026

Are your PCBs burning up? 🔥

AI, HPC, and data center systems are pushing power densities higher than ever, making thermal design a critical part of system performance and reliability.

ATS provides Scalable AI Cooling Solutions engineered from chip to system, including:

🔹 ArctiQ AI cold plates
🔹 High-performance liquid cold plates
🔹 iCDM and CDU liquid cooling systems
🔹 AI-specific heat sinks for NVIDIA Jetson™ and AMD Kria™ SOMs
🔹 Thermal design, testing, and validation support

Unlock peak performance with ATS AI & Data Center Cooling Solutions — engineered for efficiency, scalability, and reliability.

Explore ATS AI Cooling Solutions:
https://f.mtr.cool/qlgrmxuyzx

06/09/2026

ATS operates Advanced Thermal Characterization Labs in Norwood, MA, built to test, measure, and validate the thermal performance of electronic systems, components, and cooling solutions.

ATS lab capabilities support semiconductor and SSD characterization, airflow and pressure measurement, fan and blower analysis, liquid cooling evaluation, thermography, and full liquid loop testing. Using specialized tools such as wind tunnels, water flow visualization systems, and high-resolution thermal imaging, ATS helps engineers better understand system thermal behavior and improve cooling performance.

From component-level testing to full system validation, ATS provides engineering insight for electronics cooling, data center cooling, AI hardware, HPC systems, power electronics, and advanced thermal management applications.
Questions? Email: [email protected]
Learn more: https://f.mtr.cool/uwprufvjgu

V***r chambers can play an important role in spreading heat from high-power electronic devices and improving thermal per...
06/09/2026

V***r chambers can play an important role in spreading heat from high-power electronic devices and improving thermal performance in compact systems.

ATS has compiled a 17-page engineering eBook covering how v***r chambers work, how they are used with heat sinks, where they fit in electronics thermal management, and which design parameters affect v***r chamber performance.

Topics include:
🔹 What v***r chambers are and how they are used
🔹 V***r chambers paired with heat sinks
🔹 Applications in electronics thermal management
🔹 V***r chambers vs. solid bases for high-power devices
🔹 Key parameters affecting performance
🔹 How v***r chambers compare to heat pipes
🔹 V***r chamber heat transfer capability

Download the eBook:
https://f.mtr.cool/rxmmwygbpg

***rChambers

06/08/2026

Need a faster way to screen liquid cold plate options? 💧⚙️

ATS Liquid Cold Plate Design Tool helps engineers compare finned vs. tubed cold plate concepts using inputs like heat load, coolant, flow rate, ΔP, TIM & material.

Try it: https://f.mtr.cool/ttyohadjpr

ATS Technical Case Study: CFD Optimization of a Ruggedized Electro-Optical Cooling ArchitectureFor ruggedized electro-op...
06/08/2026

ATS Technical Case Study: CFD Optimization of a Ruggedized Electro-Optical Cooling Architecture

For ruggedized electro-optical systems, thermal performance must be achieved within tight packaging constraints, elevated ambient conditions, and demanding reliability expectations.

In this case study, ATS executed a baseline-to-optimized thermal design cycle for a portable threat detection / electro-optical module with mixed heat sources, a 27 W total heat load, and 40°C ambient operating conditions.

The work focused on reducing thermal resistance and improving sensor temperature stability using fan-forced convection and CFD-driven design refinement.

Read the full case study:
https://f.mtr.cool/ccgvqxbqbo

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89 Access Road Ste 27
Norwood, MA
02062

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