Advanced Thermal Solutions, Inc.

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Advanced Thermal Solutions, Inc. Advanced Thermal Solutions, Inc. Since 1989.

designs and manufactures high-performance thermal management solutions for the electronics industry, supporting air, liquid, and refrigeration-based cooling across diverse applications worldwide.

V***r chamber design requires more than estimating size. 🌡️⚙️ATS V***r Chamber Design Tool help engineers size and valid...
11/04/2026

V***r chamber design requires more than estimating size. 🌡️⚙️

ATS V***r Chamber Design Tool help engineers size and validate sealed two-phase v***r chambers against critical design requirements, including classical heat-pipe transport limits, internal thermal network behavior and pressure-vessel constraints.

Enter your heat source and boundary conditions, and the tool returns a buildable configuration, flags inputs that will not work and shows exactly what changed to make the design viable.

For engineers working with high-heat-flux electronics, compact assemblies and demanding thermal applications, ATS helps make v***r chamber design more transparent, practical and confidence-driven.

Explore ATS V***r Design Tool:
https://f.mtr.cool/c25cezu26k

***rChambers

11/03/2026

Secure heat sink attachment matters for reliable thermal performance. 🌡️⚙️

ATS push pin heat sinks give engineers a fast, mechanical attachment option for PCB-mounted components, combining aluminum heat sinks with push pins, compression springs and thermal interface options.

With over 108K possible assembly configurations, ATS push pin heat sinks support a wide range of component sizes, airflow conditions and thermal requirements.

Options include:
🔹 Straight fin, cross-cut and maxiFLOW™ geometries
🔹 Fine, ultra-fine and coarse pitch heat sinks
🔹 Brass or plastic push pins
🔹 Multiple compression spring options
🔹 Phase-change material, thermal tape or no-TIM options

From component cooling to PCB-level thermal design, ATS push pin heat sinks help engineers simplify attachment while supporting consistent thermal contact.

Explore ATS push pin heat sinks:
https://f.mtr.cool/1icsingmcu

Cold Plate Solutions for Every Cooling Challenge. 💧⚙️From high-power electronics to complex thermal designs, no two cool...
11/03/2026

Cold Plate Solutions for Every Cooling Challenge. 💧⚙️

From high-power electronics to complex thermal designs, no two cooling challenges are exactly alike. That's why Advanced Thermal Solutions (ATS) offers a comprehensive range of cold plate technologies engineered to meet diverse performance, application and system requirements.

Explore the ATS Cold Plate Family:

🔹 High-Performance Cold Plates – Engineered for demanding thermal loads requiring efficient heat removal and temperature control.

🔹 Tubed Cold Plates – Cost-effective, reliable liquid cooling solutions for a wide range of power electronics applications.

🔹 Dual-Sided, High-Flow Cold Plates – Designed to cool components on both sides of the plate while supporting higher coolant flow rates.

🔹 Custom Cold Plates – Application-specific solutions tailored to unique thermal, mechanical and manufacturing requirements.

Whether you're cooling power semiconductors, inverters, industrial equipment or high-performance electronics, ATS combines cold plate technology with thermal engineering expertise to help optimize your cooling system.

Different applications. Different thermal demands. One source for cold plate solutions.

Explore the ATS Cold Plate Family:
https://www.qats.com/Products/Liquid-Cooling/Cold-Plates

Does every 200W+ component need liquid cooling? Not always. 🌡️💨In this ATS blog, we look at how high-capacity air cooler...
11/03/2026

Does every 200W+ component need liquid cooling? Not always. 🌡️💨

In this ATS blog, we look at how high-capacity air coolers can provide an effective alternative for some high-power server components, CPUs, GPUs, FPGAs and AI processors.

Liquid cooling can deliver strong thermal performance, but it also adds system complexity, including pumps, tubing, fittings, coolant maintenance and leak risk. For certain 150W–200W+ components, a high-performance air cooler with dense fins, strong airflow and proper ducting may provide a simpler, more serviceable solution.

Key questions before choosing air or liquid cooling:

🔹 What is the component power and junction temperature requirement?
🔹 Is acoustic noise acceptable in the deployment environment?
🔹 Can chassis airflow be directed through the heat sink?
🔹 Does the system layout support high-static-pressure airflow?
🔹 Will future designs move toward much higher power levels?

Before defaulting to liquid cooling, evaluate whether high-capacity air cooling can meet the thermal target with lower complexity and easier serviceability.

Read the ATS blog:
https://www.qats.com/cms/2026/09/30/use-high-capacity-air-cooler-in-place-of-liquid-cooling-for-200w-components/

Heat sinks for NVIDIA Jetson Thor modules🪒 Robust cooling for edge computing, physical AI, and robotics platforms🪒 Activ...
11/02/2026

Heat sinks for NVIDIA Jetson Thor modules
🪒 Robust cooling for edge computing, physical AI, and robotics platforms
🪒 Active and passive cooling options
🪒 Cool up to 175W TDP at 50°C
See: https://f.mtr.cool/xbyeosa8k8
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AI at the edge needs reliable thermal performance.ATS heat sinks for AMD Kria™ K24 and K26 System-on-Modules are designe...
11/02/2026

AI at the edge needs reliable thermal performance.

ATS heat sinks for AMD Kria™ K24 and K26 System-on-Modules are designed to help engineers manage heat in compact embedded systems, industrial automation, machine vision and edge AI applications.

Available in passive and active configurations, ATS Kria heat sinks feature secure screw mounting, pre-assembled thermal interface material and compact aluminum designs built for real-world electronics cooling.

Explore ATS cooling solutions for AMD Kria SOMs:
https://f.mtr.cool/3s8airrwd7

11/02/2026

High-power AI and HPC processors need cooling designed for the socket, not just the heat load. 💧⚙️

ATS ArctiQ™ NIVIS Series Cold Plates provide socket-specific direct liquid cooling for AMD SP5 processor applications and other advanced AI and HPC systems.

Designed for compact, high-power architectures, NIVIS cold plates support up to 6.5 kW of heat dissipation with lightweight, precision-machined aluminum construction and CFD-validated performance.

For data centers, AI servers and high-density compute platforms, NIVIS helps engineers manage extreme processor heat with a cold plate built for demanding liquid cooling environments.

Explore ATS ArctiQ™ NIVIS Cold Plates:
https://www.qats.com/Products/Liquid-Cooling/AI-Chip-Coolers

11/02/2026

ATS Technical Case Study: Analytical and CFD Optimization of a 1600 W Liquid-Cooled Rack Chassis

High-power rack systems require more than adding cold plates — the full thermal architecture must be evaluated to identify the true cooling bottleneck.

In this case study, ATS used analytical calculations and CFD to optimize a liquid-cooled rack chassis integrating dual cold plates and an internal air-to-liquid heat exchanger for 1600 W heat rejection at 55°C ambient.

The work helped identify governing thermal limits and guide architecture-level improvements for a manufacturable, high-performance cooling solution.

Read the full case study:
https://f.mtr.cool/a26ph8ezu5

10/30/2026

High-power electronics need cold plates that support both performance and layout flexibility. 💧⚙️

ATS Dual-Sided High-Flow Cold Plates are designed for demanding thermal applications where power components may need to be mounted on both sides of the plate.

🎥 Watch our 46-second video to see how these cold plates support high-flow, high-power electronics cooling.

Key features:
🔹 Coolant flow rates up to 4 GPM
🔹 Thermal resistance as low as 0.0021°C/W
🔹 Dual-sided mounting for flexible component placement
🔹 Etched “NO DRILL ZONES” to help protect internal fluid channels
🔹 Component cooling areas can be drilled up to 7 mm deep

Ideal for automotive power electronics, UPS systems, wind turbines, photovoltaic inverters, induction heaters, motor drives and utility vehicles.

Learn more: https://f.mtr.cool/qovl2n0gau

10/30/2026

Hot spots can limit performance long before a full system reaches its thermal limit. 🌡️⚙️

ATS V***r Chambers help spread heat uniformly across the base of a heat sink, reducing spreading resistance and improving heat transfer in demanding electronics applications.

Designed for low-profile thermal management, ATS v***r chambers are available off the shelf or custom, with aluminum, copper and titanium options. With no moving parts and no external power, controllers or valves required, they provide a passive heat-spreading solution for compact, high-heat designs.

Applications include computing, graphics card cooling, SSD cooling, LEDs, industrial lasers and high heat flux components such as IGBTs and MOSFETs.

Explore ATS V***r Chambers:
https://f.mtr.cool/088k2uqcqx

***rChambers

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89 Access Road Ste 27
Norwood, MA
02062

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