Sunshine Global Circuits Co., Ltd.

Call Directions Website

Sunshine Global Circuits Co., Ltd. Sunshine Global PCB Group is a premier circuit board manufacturer with focus on High Mix and low-to-

PCB 101 | FR-4: Material Selection Beyond the SpecificationFR-4 is widely used in PCB manufacturing, but specifying “FR-...
10/13/2026

PCB 101 | FR-4: Material Selection Beyond the Specification

FR-4 is widely used in PCB manufacturing, but specifying “FR-4” alone does not fully define the laminate required for a design.
FR-4 refers to a family of flame-retardant, glass-reinforced epoxy laminate systems. Within that category, material properties can vary significantly between resin systems and laminate grades.

Key parameters to evaluate include:
• Tg (Glass Transition Temperature): influences dimensional behavior as the laminate moves through elevated temperatures.
• Td (Decomposition Temperature): indicates resistance to thermal decomposition.
• CTE (Coefficient of Thermal Expansion): particularly Z-axis CTE, which affects stress on plated through-holes during thermal cycling.
• Dk and Df: increasingly important as signal speeds and frequencies increase.
• Moisture absorption: relevant to both processing and long-term reliability.

Material requirements also depend on the PCB construction and assembly process. Higher layer counts, sequential lamination, lead-free reflow, high-speed signaling, and demanding operating environments can all change the appropriate laminate selection.
The important distinction is that FR-4 describes a material class — not a complete performance specification.
A reliable material selection should consider electrical performance, thermal exposure, stack-up construction, assembly conditions, and end-use requirements together.
Need help selecting a laminate for your PCB build? Our engineering team can review your material and stack-up requirements.
Request a Quote →https://shorturl.at/tTAc4

PCB West 2026 was a great opportunity to reconnect with familiar faces across the industry and meet new ones along the w...
10/08/2026

PCB West 2026 was a great opportunity to reconnect with familiar faces across the industry and meet new ones along the way.

It was especially nice catching up with long-time industry friends, exchanging perspectives, and hearing what customers and partners are seeing in the market.

We appreciated everyone who stopped by Booth #600 and took the time to connect with the Sunshine Global Circuits team.

Events like PCB West are a good reminder that strong industry relationships are built over time — through conversations, shared experience, and staying connected.

We look forward to continuing those conversations beyond the show.

Learn more about Sunshine Global Circuits and our PCB manufacturing capabilities:
https://shorturl.at/dZQRf

Why Edge Computing Is Reshaping PCB Design RequirementsAI infrastructure has spent the last few years scaling up in the ...
10/06/2026

Why Edge Computing Is Reshaping PCB Design Requirements

AI infrastructure has spent the last few years scaling up in the cloud. The next phase is scaling down — pushing compute closer to where data is actually generated.

This shift toward edge computing isn't optional. Latency-sensitive applications like autonomous driving and industrial robotics can't afford a round trip to the cloud — a delay of even milliseconds can matter. Bandwidth costs and data privacy regulations add further pressure to process data locally rather than shipping it off-site.

Industry analysts project the edge AI market growing from roughly $21 billion in 2024 to $143 billion by 2034 — a 21% CAGR.

For PCB design and manufacturing, this trend is already visible in the numbers. Automotive central control boards have moved to 14-layer, 5th-generation HDI designs. Smart cockpit domain controllers are now specifying M6 materials, any-layer construction, and 2mil/2mil line width and spacing — a level of density that simply wasn't standard a few years ago.

The takeaway for hardware teams: as more compute moves to the edge, board complexity moves with it. Designs that once relied on centralized processing now need to fit sensor fusion, real-time decision-making, and thermal management onto a much smaller, denser board.

This is a trend worth watching closely if your product roadmap includes edge AI, autonomous systems, or smart sensing at scale.

Sources: AI Edge Alliance, "AI Edge Requirements, Vision, and Potential Key Technologies" white paper; Unimicron (speaker: Zi-Zhang Tseng), "Opportunities and Challenges for the PCB Supply Chain in Response to AI System Growth"

Designing hardware for an edge AI application and want to talk through the board complexity involved? Our engineering team can help — [Request a Quote →] https://shorturl.at/tTAc4

PCB West 2026 starts tomorrow!📍 Find Sunshine at Booth #600👉 Schedule a meeting with our team: https://shorturl.at/EZSQ...
09/29/2026

PCB West 2026 starts tomorrow!
📍 Find Sunshine at Booth #600
👉 Schedule a meeting with our team: https://shorturl.at/EZSQu

We’ll be showcasing samples of our advanced PCBs for AI server and data center applications.

As AI infrastructure continues to drive higher performance requirements, our team will be there to discuss how Sunshine supports high-speed, high-density, and advanced PCB applications.

📅 September 30, 2026
📍 Santa Clara Convention Center
See you tomorrow at Booth #600!
hashtag hashtag hashtag hashtag hashtag hashtag hashtag

📣 One Week to Go | PCB West 2026One week to go!We’re getting ready for PCB West 2026 in Santa Clara.👉 Plan Your Visit & ...
09/25/2026

📣 One Week to Go | PCB West 2026

One week to go!

We’re getting ready for PCB West 2026 in Santa Clara.

👉 Plan Your Visit & Connect With Us: https://shorturl.at/EZSQu

The PCB industry is moving fast. AI-driven demand, changing material conditions, lead-time pressures, and increasingly complex technical requirements are continuing to shape how PCB projects are planned and manufactured.

At Booth #600, our team will be there to connect, exchange perspectives, and hear what you’re seeing in the market.

Whether you want to discuss materials, lead times, technical requirements, or an upcoming project, stop by and meet the Sunshine team.

📍 Santa Clara, CA

📅 September 30, 2026

📌 Booth #600

The industry is changing. See what we’re bringing to PCB West and connect with our team before the show.

📣 Holiday Notice | Mid-Autumn Festival 2026As the Mid-Autumn Festival approaches, we’d like to share our holiday schedul...
09/24/2026

📣 Holiday Notice | Mid-Autumn Festival 2026

As the Mid-Autumn Festival approaches, we’d like to share our holiday schedule with our customers and partners.

🌕 Sunshine China Factory Closed: September 25-27, 2026
Our other Sunshine locations will remain open and available to support your business as usual.
While our teams may be in different locations, we’re proud to stay connected with customers and partners around the world.
Thank you for your continued trust and partnership.
Wishing you a bright moon and a wonderful Mid-Autumn Festival! 🌕

PCB 101 | Prepreg and Core in Multilayer PCB ConstructionPrepreg and core form the dielectric structure of a multilayer ...
09/17/2026

PCB 101 | Prepreg and Core in Multilayer PCB Construction

Prepreg and core form the dielectric structure of a multilayer PCB, but they perform different functions during fabrication.

Core is a fully cured laminate, typically consisting of woven glass reinforcement and resin with copper foil bonded to one or both sides.

Prepreg (PP) is a partially cured resin system reinforced with glass fabric. During lamination, the resin flows under controlled heat and pressure before curing, bonding adjacent copper and core layers into a consolidated multilayer structure.

Material selection directly influences the finished stack-up. Glass style, resin content, cured dielectric thickness, and resin flow can affect overall board thickness, impedance control, copper encapsulation, and lamination quality.

For impedance-controlled designs, the relationship between dielectric thickness, Dk, copper geometry, and the selected prepreg construction should therefore be established during stack-up development rather than addressed after routing is complete.

Prepreg and core selection is not simply a mechanical consideration — it is part of achieving the required electrical performance and manufacturing reliability.

Need support with material selection or stack-up development? Our engineering team can review your build requirements.
Request a Quote →https://shorturl.at/NuxbV

09/15/2026

What’s next in PCB manufacturing? Come see it at PCB West 2026.

Sunshine will be at PCB West 2026 in Santa Clara on September 30.

Visit us at Booth #600 to connect with our team and explore our PCB
manufacturing capabilities, advanced technologies, and solutions for high-performance electronics.

Whether you're working on high-speed, high-density, or application-specific PCB designs, we'd love to connect and discuss how we can support your next project.

📍 Santa Clara, CA
📅 September 30, 2026
📌 Booth #600
Planning to attend? Come say hello—we’ll see you at PCB West!
Learn more: https://shorturl.at/EZSQu

Address

3400 Silverstone Drive, Ste 139
Plano, TX
75023

Opening Hours

Monday 9am - 6pm
Tuesday 9am - 6pm
Wednesday 9am - 6pm
Thursday 9am - 6pm
Friday 9am - 6pm

Telephone

(972) 867-8886

Website

Alerts

Be the first to know and let us send you an email when Sunshine Global Circuits Co., Ltd. posts news and promotions. Your email address will not be used for any other purpose, and you can unsubscribe at any time.

Shortcuts

Share

Category