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Data Center & Cloud | Carrier | Enterprise We believe that infrastructure powers progress. At Marvell, We go all in with you.

That ex*****on is as essential as innovation. That better collaboration builds better technology. Focused and determined, we unite behind your goals as our own. We leverage our unrivaled portfolio of infrastructure technology to identify the best solution for your unique needs. And we sit shoulder-to-shoulder with your teams to build it. Agile in our thinking, and our partnerships, we look for unexpected connections that deliver a competitive edge and reveal new opportunities. At Marvell, we’re driven by the belief that how we do things matters just as much as what we do. Because, with a foundation built on partnership, anything is possible.

Agentic AI transforms inference from a compute problem into a distributed, memory-intensive systems challenge. KV cache ...
10/22/2026

Agentic AI transforms inference from a compute problem into a distributed, memory-intensive systems challenge. KV cache state must be placed at the right performance tier with predictable latency and bandwidth, and no single technology solves that alone.

At the AI Networking Summit 2026, Marvell Director of Solutions Architecture Ashwin Gopalan will present a systems architecture that addresses this challenge end to end, spanning on-package HBM, host-attached memory, a shared CXL-based KV cache tier, and durable storage, unified by a Teralynx Ethernet fabric delivering the high-throughput east-west connectivity required for agent coordination, cache movement, and multi-rack inference.

Attendees will leave with a practical framework for designing AI infrastructure as an integrated compute, network, and memory system.

Learn more: https://mrvl.co/4B5rlqf

10/21/2026

Compute came first. Then memory. Now the real bottleneck is connectivity.

In this clip from a recent theCUBE conversation, Marvell Executive Vice President and General Manager of Custom Cloud Solutions Will Chu explains why connectivity has become the defining constraint in AI infrastructure, and why Marvell’s connectivity-first strategy, built on more than 20 years of investment, puts the company at the center of what comes next.

Watch the full interview: https://mrvl.co/4s5SC86

General-purpose processors remain essential. But as AI workloads grow larger, more power-constrained, and more specializ...
10/20/2026

General-purpose processors remain essential. But as AI workloads grow larger, more power-constrained, and more specialized, they are increasingly no longer being asked to do everything.

This EE Times article by Scott Seal makes a clear case for why custom silicon has moved from a specialized option to a core part of data center architecture, covering five dimensions where purpose-built hardware changes the equation: workload optimization, performance per watt, latency reduction, data movement efficiency, and long-term economics at scale.

For data center architects, the question is shifting from which processor is fastest to which parts of the workload are important enough to optimize in silicon.

Read the full article: https://mrvl.co/474wstb

10/20/2026

OCP Global Summit 2026 was a defining moment for open AI infrastructure, and Marvell was at the center of it. Nine product demonstrations, 14 speaking sessions, and a landmark announcement with Microsoft and Oracle to advance an open security standard for data centers.

The week also brought two major product announcements: second-generation Structera X CXL memory expanders with industry-first six-channel DDR4 and DDR5 support, and new Alaska A and Alaska E connectivity solutions advancing AI scale-up networks to 224G per lane.

Marvell Senior Vice President and General Manager of the Photonic Fabric Business Unit Preet Virk will deliver a keynote...
10/20/2026

Marvell Senior Vice President and General Manager of the Photonic Fabric Business Unit Preet Virk will deliver a keynote at the ISIG Executive Summit SEA in Penang, Malaysia, presenting in the Emerging Technology session focused on silicon photonics, co-packaged optics, and compound semiconductors.

ISIG brings together senior executives and decision-makers from across the global semiconductor ecosystem, making it a fitting stage for a conversation about the technology transitions reshaping AI infrastructure connectivity.

Learn more: https://mrvl.co/4s5W5Ua

10/19/2026

HBM stacks today sit 1.5 millimeters from a GPU. What if they didn’t have to?

In this clip from a recent conversation with theCUBE, Marvell Executive Vice President and General Manager of Data Center Networking Dave Lazovsky walks through the Photonic Fabric Memory Module, the first optically interconnected high-capacity, high-bandwidth memory solution, capable of delivering up to 32 terabytes of disaggregated memory capacity up to 50 meters away from compute.

For the first time, memory capacity can scale independently from compute. Watch the full interview: https://mrvl.co/4s5SC86

10/16/2026

Focus compounds. With 75 to 90% of revenue coming from the data center, Marvell invests its R&D entirely around that application, building foundational technology like SerDes that carries across the full product portfolio.

In this clip from a recent theCUBE conversation, Marvell Executive Vice President and General Manager of Custom Cloud Solutions Will Chu explains how that focus drives competitive advantage and keeps the flywheel going.

Watch the full interview: https://mrvl.co/3TDXnJg

Marvell arrived at OCP with the industry's most comprehensive portfolio of open AI infrastructure solutions, and the ene...
10/16/2026

Marvell arrived at OCP with the industry's most comprehensive portfolio of open AI infrastructure solutions, and the energy at Booth B31 reflected the momentum driving this market.

Across nine product demonstrations, Marvell showcased innovations spanning networking, interconnect, memory, storage, security, and optical connectivity, including the Teralynx T100 102.4T next-generation data center switch, Structera CXL memory solutions, Ara DSP 1.6T transmit-retimed optics, COLORZ 800G ZR/ZR+ with MACsec, active electrical and copper connectivity platforms, the Bravera PCIe 6.0 SSD controller, and an integrated hardware security module. Marvell engineers and executives also led 14 speaking sessions throughout the event.

One of the week's highlights was the announcement of a new OCP Working Group formed with Microsoft and Oracle to advance an open security standard for data centers.

The conversations at OCP reinforced what we're hearing across the industry: hyperscalers and cloud operators want open, standards-based architectures that deliver both design flexibility and operational efficiency at scale. Marvell is helping make that vision a reality.

At the OCP Global Summit 2026 Innovation Village, Marvell and NXP are demonstrating cross-vendor interoperability for th...
10/15/2026

At the OCP Global Summit 2026 Innovation Village, Marvell and NXP are demonstrating cross-vendor interoperability for the Open Boot Management Framework Interface Consolidation Protocol, a key OCP specification that standardizes communication between host processors and baseboard management controllers.

The live demo shows Marvell IMC processors running an OBMF ICP software stack over USB, supporting a range of sensor interfaces including I2C, I3C, GPIO, UART, and SPI. The OBMF workstream includes major industry participants across the data center ecosystem, reflecting strong momentum toward unified, open out-of-band platform management for AI and cloud infrastructure.

The broader significance: as AI data centers grow in scale and complexity, standardized management interfaces reduce deployment complexity, eliminate vendor lock-in, and make large-scale infrastructure easier to operate. Marvell’s leadership in OBMF ICP positions its IMC processor family as a platform for the open, secure management layer that next-generation data centers require.

10/15/2026

Skipping a process node is almost unheard of in the semiconductor industry. Marvell did it anyway.

In this clip from a recent conversation with theCUBE, Marvell Executive Vice President and General Manager of Custom Cloud Solutions Will Chu explains the decision made around 2018 and 2019 to jump directly from 16nm to 5nm, bypassing 7nm entirely, and how that commitment to leading-edge process technology, continued through 3nm, 2nm, and 14 angstrom, became the foundation for the company’s growth in cloud and data center infrastructure.

Watch the full interview: https://mrvl.co/3TDXnJg

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95054

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