Applied Materials

Applied Materials We deliver material innovation that changes the world.

09/01/2026

High-bandwidth memory (HBM) has become a foundational technology for the AI era, delivering the bandwidth needed to keep increasingly powerful AI processors fed with data.

Achieving these bandwidth gains requires stacking more DRAM, driving the industry’s transition to 12-layer HBM stacks and beyond. However, as die are thinned to meet package height requirements, warpage becomes increasingly difficult to control.

Watch Dr. Jinho An, Senior Director of Heterogeneous Integration in the Semiconductor Products Group, explain how Applied's new Producer Avila 2 PECVD system helps manufacturers overcome this challenge and advance the next generation of HBM.

Applied Materials was honored to host Congresswoman Zoe Lofgren to discuss our critical role in advancing semiconductor ...
08/31/2026

Applied Materials was honored to host Congresswoman Zoe Lofgren to discuss our critical role in advancing semiconductor innovation and historical investment in the EPIC Center. The center is designed from the ground up to dramatically reduce the time it takes to commercialize breakthrough technologies from early-stage research to full-scale manufacturing.

This is where world-changing careers begin. Applied Materials' New College Graduate program connects you with industry e...
08/27/2026

This is where world-changing careers begin. Applied Materials' New College Graduate program connects you with industry experts, global teams and development resources that help accelerate learning, leadership and innovation. In fact, nearly 1 in 10 VPs and approximately 1 in 13 directors started here as new college grads. Apply now. https://bit.ly/4gJIwFA

AI compute is outpacing gains in bandwidth and efficiency, pushing the industry swiftly into HBM and 3D stacking. But st...
08/26/2026

AI compute is outpacing gains in bandwidth and efficiency, pushing the industry swiftly into HBM and 3D stacking. But stacking more DRAM layers isn't easy, it takes real material innovation, and it's exactly why we built Producer Avila 2 PECVD.

To fit more layers into an HBM stack, DRAM dies are thinned to roughly 1/25th the thickness of a standard wafer. At that thickness dies warp easily and that effect compounds as you stack 12, 16, or more layers, increasing the risk of bonding failure and yield loss when reliability matters most.

Producer Avila 2 solves this challenge: a PECVD system that deposits stress-balanced dielectric films around TSVs, stabilizing ultra-thin DRAM dies so they can stack reliably at today's 12- and 16-layer HBM designs. Balance the stress at deposition, and you don't have to fight warpage later during bonding.

As HBM becomes the default path to more AI memory bandwidth, die-level mechanical stability isn't a nice-to-have, it's the yield-determining variable. Learn more: https://bit.ly/4vkoiqb

08/25/2026

AI is pushing package sizes beyond the practical limits of traditional silicon interposers—driving the industry toward a new packaging paradigm. Watch Dr. Jinho An, Senior Director of Heterogeneous Integration in the Semiconductor Products Group, explain why panel-based packaging is emerging as a promising path forward. By directly tackling larger form factors and emerging substrate materials like glass, we are helping unlock the next era of AI system scaling.

At Applied Materials, we’re committed to delivering breakthrough technology that scales the energy efficient computing r...
08/24/2026

At Applied Materials, we’re committed to delivering breakthrough technology that scales the energy efficient computing roadmap. We’ve accelerated our transition to renewable energy, powering operations with cleaner, more sustainable sources. Today, we’re matching 75% of our global electricity use with renewable energy and maintaining 100% renewable electricity across U.S. operations—a major step toward our 2030 sustainability goal and advancing sustainability in the semiconductor industry. 🔗 Learn how we’re scaling clean energy in our 2025 Impact Report: https://bit.ly/3TxcovI

Colm is one of our talented engineers, solving complex challenges in support of our customers worldwide. His work enable...
08/20/2026

Colm is one of our talented engineers, solving complex challenges in support of our customers worldwide. His work enables the technologies that power AI, advanced computing and next-generation electronics. Join our Field Service Engineer team and make an impact that extends across the globe and into the future. Apply now.
https://bit.ly/45adBvS

08/18/2026

Pathfinding work on 3D DRAM is already underway, laying the foundation for the next era of memory innovation and AI computing.

Watch Dr. Sony Varghese, Managing Director of Technology Strategy in the Semiconductor Products Group, explain why 3D DRAM will require a fundamentally different materials engineering approach than 3D NAND—relying on advanced capabilities that have long been key areas of Applied’s leadership.

AI is driving transformation for every industry, and semiconductors are at the center of making that transformation poss...
08/17/2026

AI is driving transformation for every industry, and semiconductors are at the center of making that transformation possible. The challenge ahead is not simply to build more chips, but to create new architectures that deliver higher performance with greater energy efficiency. Applied Materials is enabling those innovations through deep materials engineering expertise and close collaboration with customers across the technology stack. We deliver material innovation that changes the world.

08/14/2026

Si En’s journey is proof that starting strong can fuel every step of your journey. From internships to the New College Graduate (NCG) Program to a full-time engineering role, he’s built skills, confidence and connections. At Applied Materials, you’ll gain real ownership, broad exposure and opportunities to make an impact. Launch your career in our NCG Program:
https://bit.ly/44ZUwwg

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