08/18/2026
AI data centers, HVDC substations, and fusion machines all run into the same limit in the same place: the polymer film inside the capacitor. Push the temperature up, and the film is what gives out first.
The usual answer is to wait for a better resin. We take a different route.
Our NanoPlex™ technology coextrudes commercially available polymers into tens to thousands of alternating layers, each one thinner than a wavelength of visible light. Below roughly 250 nanometers, polymers stop behaving the way they do in bulk. Crystals orient flat in the plane of the film. Every interface between layers becomes a charge trap that interrupts electrical trees before they cascade into breakdown.
That turns layer thickness, layer order, and material pairing into design variables. Instead of waiting a decade for new chemistry, we engineer the property a customer needs out of polymers the industry already produces, sources, and trusts.
NanoPlex LDF is that idea in the market today. A low dissipation factor film that runs at 135 °C versus 105 °C for standard BOPP-C film, which gives design teams thermal headroom to derate less, use fewer capacitors, and reduce cooling infrastructure and parts across the system.
And the same nanolayer technology is enabling performance breakthroughs across critical industries, from energy and e-mobility to aerospace, defense, and food and medical packaging.
Architecture, not new chemistry.
