Trafalgar Publications Ltd

07/09/2026

🇺🇸 Happy Labor Day from Global SMT & Packaging!

Today, we recognize the hard work, dedication, and commitment of the people who keep our industries moving forward.

From manufacturing and engineering to technology, innovation, and every role behind the scenes, progress is built by people who show up, solve problems, create, and keep pushing ahead.

Thank you to the professionals across the electronics manufacturing and advanced packaging industries for everything you do.

Wishing everyone a safe, relaxing, and well-deserved Labor Day!

03/09/2026

02/09/2026

Attending productronica India South 2026?

Pick up your copy of Global SMT & Packaging at Booth H4.C105 and explore the latest news, interviews, and insights from the electronics manufacturing industry.

See you at the show!

20/08/2026

Equipment Bottlenecks, CoWoS vs EMIB & Photonics Push

In this episode of GAP Talk, Trevor Galbraith and Jillian McNichol discuss the growing capital equipment bottleneck as lead times stretch to two years. Counterpoint Research produced a "trillion-dollar bottleneck" report on TSMC's CoWoS versus Intel's EMIB, ZAM and XBM packaging platforms.

Lightmatter's new Open Silicon Photonics initiative within the Open Compute Project. A series of major semiconductor investments surge across India, Thailand and Vietnam. And finally, the ECTC 2027 Call for Papers.

Subscribe for weekly insights from the advanced packaging industry.

19/08/2026

The latest issue of Global SMT & Packaging is out — our EFX Show Issue packed with practical insight for electronics manufacturing and advanced packaging professionals.

Inside this issue:

• Selecting a Parylene Conformal Coating
• Managing Residues from Thermal Processing
• Controlling Warpage and Microvia Reliability
• Liquid Cooling
• Exclusive interview with Joel Scutchfield, General Manager, Koh Young Americas

From process reliability to next-generation cooling and manufacturing technology, this issue covers the challenges shaping today's electronics industry.

📖 Read the latest issue here:
https://www.globalsmt.net/magazine

13/08/2026

GAP Talk: SK Hynix's $38B Fab Bet, AMD Buys Taalas & TSMC's Sub-1nm Breakthrough

This week on GAP Talk, Trevor and Jillian break down SK hynix's $38 billion investment in two new Korean fabs to supercharge HBM and AI storage capacity, Onto Innovation's $720M stake in X-ray specialist Rigaku, and AMD's acquisition of Canadian startup Taalas to challenge NVIDIA in AI inference. Plus: ACM Research lands its first panel-level electroplating orders, Veeco's MOCVD win for indium phosphide lasers, Koh Young expands into India, and TSMC edges closer to sub-1nm chips.

07/08/2026

What’s shaping the semiconductor industry this week?

The latest GAP Talk covers the U.S. ban on Chinese robotics, $874M in semiconductor commitments involving GlobalFoundries, Multibeam, and Kepler Computing, major industry acquisitions, and India’s rapid chip-manufacturing expansion.

31/07/2026

SEMICON West is returning to Phoenix in April 2027—but why does this move matter for the semiconductor industry?

In the latest episode of "GAP Talk", we explore the significance of SEMICON West’s return and what it could mean for innovation, advanced packaging, and the future of semiconductor manufacturing.

▶️ Watch on YouTube https://youtu.be/SqweOev029g
🎧 Listen on Spotify https://open.spotify.com/episode/4plQRJQ1fBb8JgftjkPA59?si=WWNuEVZAQX-oU8w2MSAh5w

29/07/2026

Heading to SMTA International 2026? Meet Global SMT & Packaging at Booth #2507 in Rosemont, IL, October 26–29.

Apply for a free video interview and put your technology in front of a global electronics-manufacturing audience. Sponsorship opportunities are also available.

Learn more: https://www.globalsmt.net/smta-international/